Adaptable graphics board form factor with adjacent orientation to a motherboard for use with plural external I/O requirements in information handling systems

ABSTRACT

A system and method of implementing an adaptable graphics board form factor design comprising an adaptable graphics board including a reconfigurable zone subset of components including a reconfigurable I/O module having display data ports disposed along a first edge of the adaptable graphics board, the adaptable graphics board including a set of core components including the graphics processor and graphics memory, wherein the reconfigurable zone subset of components are orientable relative to the set of core components to interface with an information handling system chassis of a first model specification selected from a plurality of model specifications for information handling systems in which the adaptable graphics board may be used, and the adaptable graphics board including a connector pad interface area for receiving an array of compressible electrical spring contacts of a compression jumper pad for a flexible compression jumper connector, wherein the connector pad interface area is disposed along a second edge of the adaptable graphics board for alignment adjacent to a motherboard to be operatively coupled via the flexible compression jumper connector in the information handling system.

This application is a continuation of prior application Ser. No.15/951,101, entitled “Adaptable Graphics Board Form Factor with AdjacentOrientation to a Motherboard for use with Plural External I/ORequirements in Information Handling Systems,” filed on Apr. 11, 2018,which is assigned to the current assignee hereof and is incorporatedherein by reference in its entirety.

CROSS REFERENCE TO RELATED APPLICATIONS #

This application is related to U.S. application Ser. No. 15/950,817,filed Apr. 11, 2018, entitled “An Adaptable Graphics Board with aReconfigurable I/O Module Board for use in Information HandlingSystems,” invented by Arnold Thomas Schnell et al., and assigned to theassignee hereof.

This application is related to U.S. application Ser. No. 15/951,125,filed Apr. 11, 2018, entitled “Relative Height Adjustable ConnectorSystem for Motherboard to Graphics Board Transition in InformationHandling Systems,” invented by Arnold Thomas Schnell et al., andassigned to the assignee hereof.

FIELD OF THE DISCLOSURE

The present disclosure generally relates to a method and apparatus forconnector systems for board transitions among components of aninformation handling system.

BACKGROUND

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option is an information handling system. An information handlingsystem generally processes, compiles, stores, or communicatesinformation or data for business, personal, or other purposes.Technology and information handling needs and requirements can varybetween different applications. Thus, information handling systems canalso vary regarding what information is handled, how the information ishandled, how much information is processed, stored, or communicated, andhow quickly and efficiently the information can be processed, stored, orcommunicated. The variations in information handling systems allowinformation handling systems to be general or configured for a specificuser or specific use such as financial transaction processing, airlinereservations, enterprise data storage, or global communications. Inaddition, information handling systems can include a variety of hardwareand software resources that can be configured to process, store, andcommunicate information and can include one or more computer systems,graphics interface systems, data storage systems, and networkingsystems. Information handling systems can also implement variousvirtualized architectures. Data communications among informationhandling systems may be via networks that are wired, wireless, opticalor some combination. Further, powerful graphics system may be desirablefor use with current applications even for information handling systemshave limited internal space to house components or for informationhandling systems requiring thin profiles such as mobile informationhandling systems. Components within information handling systemsperforming various functions may need to be designed for implementationin many form factors requiring variation to maintain space efficiency.The components within information handling systems may be more costefficient when designed to be conformable to available characteristicsof several information handling system models to minimize costs ofre-designing entire components or component layouts between models andfurther decrease design complexities.

BRIEF DESCRIPTION OF THE DRAWINGS

It will be appreciated that for simplicity and clarity of illustration,elements illustrated in the Figures are not necessarily drawn to scale.For example, the dimensions of some elements may be exaggerated relativeto other elements. Embodiments incorporating teachings of the presentdisclosure are shown and described with respect to the drawings herein,in which:

FIG. 1 is a block diagram illustrating an information handling systemaccording to an embodiment of the present disclosure.

FIG. 2A is a perspective view of an MxM graphics board connector formobile information handling system;

FIG. 2B is a graphic diagram showing a cross-section view of an offsetbetween component boards with an MxM graphics board connector;

FIG. 3A is graphic diagram of a flexible compression jumper connectoraccording to an embodiment of the present disclosure;

FIG. 3B is a perspective view of a flexible compression jumper connectoraccording to an embodiment of the present disclosure;

FIG. 3C is a graphic diagram showing a cross-section view of an offsetcorrection for height difference between component boards with aflexible compression jumper connector according to an embodiment of thepresent disclosure;

FIG. 3D is a graphic diagram showing a cross-section view of a flexiblecompression jumper connector used with a motherboard and graphics boardaccording to another embodiment of the present disclosure;

FIG. 3E is a graphic diagram showing a top view of graphics board with acompression connector pad interface area for operative coupling to aflexible compression jumper connector according to an embodiment of thepresent disclosure;

FIG. 4 is a perspective view of component boards in an informationhandling system cut away to show the flexible compression jumperconnector between component boards according to an embodiment of thepresent disclosure;

FIG. 5A is a top view of graphics board according to an adaptablegraphics board form factor with adjacent orientation to a motherboardaccording to an embodiment of the present disclosure;

FIG. 5B is a top view of graphics board according to an adaptablegraphics board form factor with adjacent orientation to a motherboardaccording to another embodiment of the present disclosure;

FIG. 6A is a top view of graphics board according to an adaptablegraphics board form factor having a reconfigurable zone according to anembodiment of the present disclosure;

FIG. 6B is a top view of graphics board according to an adaptablegraphics board form factor having a reconfigurable zone according toanother embodiment of the present disclosure;

FIG. 6C is a top view of a reconfigurable zone for an adaptable graphicsboard form factor according to an embodiment of the present disclosure;

FIG. 7 is a flow diagram illustrating method of assembly with a graphicsboard having a customized reconfigurable zone within the adaptablegraphics board form factor according to an embodiment of the presentdisclosure;

FIG. 8A is a top view of an adaptable graphics board having areconfigurable I/O module board operatively coupled in a firstorientation according to an embodiment of the present disclosure;

FIG. 8B is a top view of an adaptable graphics board having areconfigurable I/O module board operatively coupled in a secondorientation according to another embodiment of the present disclosure;

FIG. 8C is a top view of a reconfigurable I/O module board according toan embodiment of the present disclosure;

FIG. 8D is a top view of an adaptable graphics board having areconfigurable I/O module interface according to an embodiment of thepresent disclosure;

FIG. 9 is cross-section view of a dual compression connector accordingto an embodiment of the present disclosure;

FIG. 10A is a block diagram showing an adaptable graphics board andreconfigurable I/O module board with external I/O connectors in a firstorientation according to an embodiment of the present disclosure;

FIG. 10B is a block diagram showing an adaptable graphics board andreconfigurable I/O module board with external I/O connectors in a secondorientation according to another embodiment of the present disclosure;and

FIG. 11 is a flow diagram illustrating method of assembly with anadaptable graphics board with a reconfigurable I/O module boardaccording to an embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE DRAWINGS

The following description in combination with the Figures is provided toassist in understanding the teachings disclosed herein. The descriptionis focused on specific implementations and embodiments of the teachings,and is provided to assist in describing the teachings. This focus shouldnot be interpreted as a limitation on the scope or applicability of theteachings.

In the embodiments described herein, an information handling systemincludes any instrumentality or aggregate of instrumentalities operableto compute, classify, process, transmit, receive, retrieve, originate,switch, store, display, manifest, detect, record, reproduce, handle, oruse any form of information, intelligence, or data for business,scientific, control, entertainment, or other purposes. For example, aninformation handling system can be a personal computer, a consumerelectronic device, a network server or storage device, a switch router,wireless router, or other network communication device, a networkconnected device (cellular telephone, tablet device, etc.), or any othersuitable device, and can vary in size, shape, performance, price, andfunctionality. The information handling system can include memory(volatile (e.g. random-access memory, etc.), nonvolatile (read-onlymemory, flash memory etc.) or any combination thereof), one or moreprocessing resources, such as a central processing unit (CPU), agraphics processing unit (GPU), hardware or software control logic, orany combination thereof. Additional components of the informationhandling system can include one or more storage devices, one or morecommunications ports for communicating with external devices, as wellas, various input and output (I/O) devices, such as a keyboard, a mouse,a video/graphic display, or any combination thereof. The informationhandling system can also include one or more buses operable to transmitcommunications between the various hardware components. Portions of aninformation handling system may themselves be considered informationhandling systems.

FIG. 1 shows an information handling system 10 capable of administeringeach of the specific embodiments of the present disclosure. Theinformation handling system 10 can represent information handlingsystems with motherboard and graphics board arrangements shown in FIGS.2-4 and implementation of the embodiments described in FIG. 5 and FIG. 6. Information handling system 10 may represent an information handlingsystem such as a mobile information handling system with enhancedgraphics processing capabilities. A mobile information handling systemmay execute instructions via a processor for a plurality of applicationprograms and operating systems as understood. Information handlingsystem 10 may also represent a networked server or other system. Theinformation handling system 10 may include a processor such as a centralprocessing unit (CPU) 105, a graphics processing unit (GPU) 106, orboth. Moreover, the information handling system 10 can include a mainmemory 109 and a static memory 110 that can communicate with each othervia a bus 118.

As shown, the information handling system 10 may further include a videodisplay 125 and in some embodiments a second display screen 135 or moredisplay screens. Display screens 125 or 135 may be of a variety ofdisplay devices, such as a liquid crystal display (LCD), an organiclight emitting diode (OLED), a flat panel display, a solid statedisplay, or a cathode ray tube (CRT). Display 125 or 135 may include oneor more touch screen display module and touch screen controllers 130 and140 for receiving user inputs to the information handling system 10. Inthe case of information handling systems with flat panel display systemsincluding LCD or OLED displays, it is desirable to minimize a thicknessof the information handling system while maximizing the power of thegraphics display system to accommodate, for example, a large size of thedisplay(s) on the surface of the information handling system. In somecases, mobile information handling systems may have very limitedthickness in a chassis to accommodate the display, motherboard, and aseparate graphics board for enhanced graphics processing power orperformance. Thus, the thickness or “Z” dimension space may be verylimited for internal components and may particularly be limitedaccording to current systems for linking a motherboard and distinctgraphics board. Additionally, multiple levels for a CPU 105 and GPU 106may require a complex system of bends and angles when a shared heat pipesystem is employed or may require two separate heat pipes for the CPU105 and GPU 106. A heat pipe with complex bends may be less efficientand costlier to manufacture. Multiple heat pipes may increase costs ofan information handling system as well. Current connectors forelectrical communication connections within the chipset from CPU 105 andGPU 106 may include MxM connectors which may require a right angleconnection or otherwise elevated connection and place a motherboard andgraphics board at different levels which may contribute to an overallthickness of an information handling system.

According to embodiments of the disclosure, a flexible compressionjumper connector 160 with a plurality of compression jumper pads havingcompressible communication contacts for operatively coupling toconnector pad interface areas on the motherboard and graphics boardsrespectively. The flexible compression jumper connector 160 includes aflexible jumper trace array cable, which may be a ribbon cable connectoror array of electrical traces, and which provides for an adjustabletransition between levels of the compression jumper pads to link themother board and graphics boards electrically for communication. In someembodiments, the compressible communication contacts may include anarray of compressible electrical spring contacts on each compressionjumper pad. In yet other embodiments, the compressible communicationcontacts, such as an array of compressible electrical spring contacts,may be mounted on the motherboard or graphics board facing away from themotherboard or graphics board. The compression jumper pads a flexiblecompression jumper connector 160 in such an embodiment have electricalcontacts that compress the compressible communication contacts mountedto the motherboard and graphics board at connector pad interface areas.The compressible communication contacts in such an embodiment may besoldered to the motherboard and graphics board respectively in someembodiments. Other mounting systems may be used to establish electricalconductivity for communications via the board connector pad interfaceareas and between the CPU and GPU mounted on the motherboard andgraphics boards respectively in other embodiments as well.

The flexible compression jumper connector 160 includes a flexible jumpertrace array cable, which may be a ribbon cable connector or array ofelectrical traces, and which provides for an adjustable transitionbetween levels of the compression jumper pads to link the mother boardand graphics boards electrically for communication. In some embodiments,the compressible communication contacts may include an array ofcompressible electrical spring contacts on each compression jumper pad.In yet other embodiments, the compressible communication contacts, suchas an array of compressible electrical spring contacts, may be mountedon the motherboard or graphics board facing away from the motherboard orgraphics board. The compression jumper pads a flexible compressionjumper connector 160 in such an embodiment have electrical contacts thatcompress the compressible communication contacts mounted to themotherboard and graphics board at connector pad interface areas.

Due to the material metal or metal alloy used with a flexiblecompression jumper connector 160 having compression jumper pads withcompressible communication contacts for operatively coupling toconnector pad interface areas on the motherboard and graphics boardsrespectively, some issues may arise during mechanical contact andcompression of the compressible communication contacts with thecorresponding PCB electrical contacts of the connector pad interfaceareas. PCB boards are frequently required to be finished with a coatinglayer to avoid tarnish, damage from thermal shock or humidity of the PCBincluding copper exposed areas such as electrical contacts and the like.The finish use must be solderable such that the finish is eliminated byflux during the soldering process while maintaining protection of copperfrom oxidation when not soldered. An example finish includes OrganicSolderability Preservatives (OSP) as an anti-tarnish layer applied toPCBs.

A compression electrical connection however may not be compatible withan OSP finished PCB board since not flux or solder is applied to createthe electrical connection. Further, the OSP may cause possible chemicalreaction to the metal or metal allow used with the compressiblecommunication contacts of the flexible compression jumper connector 160.As a solution, localized plating of the electrical contacts in theconnector pad interfaces may be conducted with a neutral metal interfacethat provides sufficient conductivity. However, localized plating at theelectrical contacts of the connector pad interfaces may be an expensiveor inefficient process. Often the plating includes a gold component,gold alloy, or even a silver alloy such as electroless nickel immersiongold (ENIG), gold flash, or hard gold plating. Thus, additional cost isincurred if the plating involves a greater area with masking and thelike than the localized connector pad interfaces. A localized platinginterposer is developed for a transition between the PCB electricalconnectors in the connector pad interface areas of the motherboard andgraphics board which may have an array of plated electrical connectorson one side. The localized plating interposer may be inserted betweenthe connector pad interface to which it is soldered on the motherboardor graphics board and the compression pads of the flexible compressionjumper connector 160

In various embodiments, the flexible compression jumper connector 160allows for adjacent placement of motherboards along the graphics boardswithout substantial additional height or “Z” dimension occupancy ofthose boards to maintain a thin information handling system profile.Further, the flexible compression jumper connector 160 may accommodatechannels or data lanes for various digital display data communicationstandards including bus architectures such as PCIe or display datainterface standards such as DisplayPort (DP), or eDP. Such standards maybe used for communications between the CPU 105 and GPU 105 mounted onseparate cards. Additional lanes or channels of PCIe, DP, or otherstandard digital display data communications may be achieved withutilization of a plurality of flexible compression jumper connectors 160between the motherboard and graphics board while maintaining theadvantages of minimizing thickness and offset between levels of the CPU105 and GPU 106.

Additionally, the information handling system 10 may include an inputdevice 115, such as a keyboard, and a cursor control device, such as amouse or touchpad or similar peripheral input device. The informationhandling system may include a power source such as battery or an A/Cpower source (not shown). The information handling system 10 can alsoinclude a disk drive unit 111, and a signal generation device such as aspeaker or remote control or other device (not shown). The informationhandling system 10 can include a network interface device 40 such as awireless adapter or similar wireless radio system to accommodate avariety of wireless communication protocols. The information handlingsystem 10 can also represent a server device whose resources can beshared by multiple client devices, or it can represent an individualclient device, such as a desktop personal computer, a laptop computer, atablet computer, a mobile smartphone, or a wearable computing device.

The information handling system 10 can include a set of instructions 123that can be executed to cause the computer system to perform any one ormore methods or computer-based functions. Various software modulescomprising application instructions 124 may be coordinated by anoperating system (OS) 122 and via an application programming interface(API). An example operating system may include Windows®, Android®, andother OS types known in the art. Example APIs may include Win 32, CoreJava API, or Android APIs. In a further example, processor 105 mayconduct processing of sets of instructions in software, firmware,hardware or any combination of the same to achieve functions understoodto be performed by the information handling system 10 according todisclosures herein. Further one or more embedded controllers 120 mayalso be included in the chipset, on the motherboard, or in the graphicsboard to provide for additional processing or execution of instructionsin addition to processing conducted by the CPU 105 or GPU 106 asunderstood in some embodiments. The computer system 10 may operate as astandalone device or may be connected such as using a network, to othercomputer systems or peripheral devices.

In a networked deployment, the information handling system 10 mayoperate in the capacity of a server or as a client user computer in aserver-client user network environment, or as a peer computer system ina peer-to-peer (or distributed) network environment. The informationhandling system 10 can also be implemented as or incorporated intovarious devices, such as a personal computer (PC), a tablet PC, aset-top box (STB), a PDA, a mobile information handling system, apalmtop computer, a laptop computer, a desktop computer, acommunications device, a wireless telephone, a land-line telephone, acontrol system, a camera, a scanner, a facsimile machine, a printer, apager, a personal trusted device, a web appliance, a network router,switch or bridge, or any other machine capable of executing a set ofinstructions (sequential or otherwise) that specify actions to be takenby that machine. In a particular embodiment, the computer system 10 canbe implemented using electronic devices that provide voice, video, ordata communication. Further, while a single information handling system10 is illustrated, the term “system” shall also be taken to include anycollection of systems or sub-systems that individually or jointlyexecute a set, or multiple sets, of instructions to perform one or morecomputer functions.

The static memory 110 or disk drive unit 111 may include acomputer-readable medium in which one or more sets of instructions 123such as software can be embedded or stored. Similarly, main memory 109and static memory 110 may also contain computer-readable medium forstorage of one or more sets of instructions, parameters, or profiles123. The disk drive unit 111 and static memory 110 also contains spacefor data storage. Further, the instructions 123 may embody one or moreof the methods or logic for applications, such as 124, that operate onthe information handling system to display graphical content asdescribed herein. For example, instructions relating to the varioussoftware algorithms and data may be stored here. The instructions,parameters, and profiles 123 may reside completely, or at leastpartially, within the main memory 109, the static memory 110, and/orwithin the disk drive 111 during execution by the processor 105 ofinformation handling system 10. As explained, some or all the software,firmware or hardware instructions may be executed locally or remotely.The main memory 109 and the processor 105 also may includecomputer-readable media.

The network interface device 40, such as a wireless adapter, can provideconnectivity to a network 128, e.g., a wide area network (WAN), a localarea network (LAN), wireless local area network (WLAN), a wirelesspersonal area network (WPAN), a wireless wide area network (WWAN), orother network. Connectivity may be via wired or wireless connection.Wireless adapter 40 may include one or more radio frequency subsystemswith transmitter/receiver circuitry, wireless controller circuitry,amplifiers and other circuitry for wireless communications. Eachradiofrequency subsystem may communicate with one or more wirelesstechnology protocols. The wireless adapter 40 may also include antennasystem which may be tunable antenna systems in some embodiments.

The wireless adapter 40 may operate in accordance with any wireless datacommunication standards. To communicate with a wireless local areanetwork, standards including IEEE 802.11 WLAN standards, IEEE 802.15WPAN standards, WWAN such as 3GPP or 3GPP2, or similar wirelessstandards may be used. Wireless adapter 120 may connect to anycombination of macro-cellular wireless connections including 2G, 2.5G,3G, 4G, 5G or the like from one or more service providers. The wirelessadapter 40 can represent an add-in card, wireless network interfacemodule that is integrated with a main board of the information handlingsystem or integrated with another wireless network interface capability,or any combination thereof. In an embodiment the wireless adapter 40 mayinclude one or more radio frequency subsystems including transmittersand wireless controllers for connecting via a multitude of wirelesslinks. The radio frequency subsystems include wireless controllers tomanage authentication, connectivity, communications, power levels fortransmission, buffering, error correction, baseband processing, andother functions of the wireless adapter 40. The wireless adapter 40 mayalso connect to the external network via a WPAN, WLAN, WWAN or similarwireless switched Ethernet connection. The wireless data communicationstandards set forth protocols for communications and routing via accesspoints, as well as protocols for a variety of other operations.

In some embodiments, dedicated hardware implementations such asapplication specific integrated circuits, programmable logic arrays andother hardware devices can be constructed to implement one or more ofthe applications operating on the information handling system 10.Applications that may include the apparatus and systems of variousembodiments can broadly include a variety of electronic and computersystems. One or more embodiments may implement functions using two ormore specific interconnected hardware modules or devices with relatedcontrol and data signals that can be communicated between and throughthe modules, or as portions of an application-specific integratedcircuit.

In accordance with various embodiments of the present disclosure, theapplications executed by the information handling system may beimplemented by software programs executable by a computer system.Further, in an exemplary, non-limited embodiment, implementations caninclude distributed processing, component/object distributed processing,and parallel processing. Alternatively, virtual computer systemprocessing can be constructed to implement one or more of the methods orfunctionality as described herein.

The present disclosure contemplates a computer-readable medium thatincludes instructions, parameters, and profiles 123 or receives andexecutes instructions, parameters, and profiles 123 responsive to apropagated signal; so that a device connected to a network 50 cancommunicate voice, video or data over the network 50. Further, theinstructions 123 may be transmitted or received over the network 50 viathe network interface device or wireless adapter 40.

In other aspects, computer-readable medium that includes instructions,parameters, and profiles 123 or receives and executes instructions,parameters, and profiles 123, such as from applications 124 or OS 122,responsive to a propagated signal may communicate digital display dataor instructions via flexible compression jumper connector 160. Digitaldisplay data may eventually be propagated to the graphic board and GPU106 for processing via the GPU 106, graphics memory 107 and distributedvia display pipes 148 to a first display screen 125 in some embodiments.In other embodiments, a second display screen 135 may also be deployed.

Information handling system 10 includes one or more application programs124, and Basic Input/Output System and firmware (BIOS/FW) code. BIOS/FWcode functions to initialize information handling system 10 on power up,to launch an operating system 122, and to manage input and outputinteractions between the operating system and the other elements ofinformation handling system 10. In a particular embodiment, BIOS/FW coderesides in memory 109, and includes machine-executable code that isexecuted by processor 105 to perform various functions of informationhandling system 10. In another embodiment, application programs 124 as apart of various instructions 123 and BIOS/FW code reside in anotherstorage medium of information handling system 10. For example,application programs and BIOS/FW code can reside in drive 111, in a ROM(not illustrated) associated with information handling system 10, in anoption-ROM (not illustrated) associated with various devices ofinformation handling system 10, in storage system 109, static memory110, in a storage system (not illustrated) associated with networkchannel of a wireless adapter 40, in another storage medium ofinformation handling system 10, in display memory 107 in parts or in anycombination thereof. Application programs 124 and BIOS/FW code can eachbe implemented as single programs, or as separate programs carrying outthe various features as described herein.

While the computer-readable medium is shown to be a single medium, theterm “computer-readable medium” includes a single medium or multiplemedia, such as a centralized or distributed database, and/or associatedcaches and servers that store one or more sets of instructions. The term“computer-readable medium” shall also include any medium that is capableof storing, encoding, or carrying a set of instructions for execution bya processor or that cause a computer system to perform any one or moreof the methods or operations disclosed herein.

In a non-limiting, exemplary embodiment, the computer-readable mediumcan include a solid-state memory such as a memory card or other packagethat houses one or more non-volatile read-only memories. Further, thecomputer-readable medium can be a random access memory or other volatilere-writable memory. Additionally, the computer-readable medium caninclude a magneto-optical or optical medium, such as a disk or tapes orother storage device to store information received via carrier wavesignals such as a signal communicated over a transmission medium.Furthermore, a computer readable medium can store information receivedfrom distributed network resources such as from a cloud-basedenvironment. A digital file attachment to an e-mail or otherself-contained information archive or set of archives may be considereda distribution medium that is equivalent to a tangible storage medium.Accordingly, the disclosure is considered to include any one or more ofa computer-readable medium or a distribution medium and otherequivalents and successor media, in which data or instructions may bestored.

FIG. 2A illustrates a perspective view of MxM connector 212 on amotherboard 220 according to examples of connector systems used in theprior art. For example, MxM connector 212 is mounted to a motherboard220 and includes a plurality of connector wires 214 providing for a 90degree angle turn of communication connector array socket 210.Communication connector array socket 210 shows an array of wires forillustrative purposes to show the parallel connectivity between themotherboard 220 and where a graphics board would be mounted in socket210. The MxM connector socket 210 may be connected to a graphics boardarranged parallel to mother board 220. The graphics board (not shown) isconnected via connector socket 210 causing a substantial offset betweenthe motherboard 220 and the graphics board such that additionalthickness may be required within an information handling system chassis.

FIG. 2B shows a cross section of an MxM connector 212 and the offsetbetween a mother board 220 and a graphic board 230. The MxM connectorhas a connector socket 210 in which a graphics board 230 may fitincluding an array of electrical contacts 232 at the edge of thegraphics board 230. The edge mounted electrical contacts 232 fit intothe socket 210 of the MxM connector 212. The MxM connector 212 providesfor a 90-degree angle turn for communication via connectors 214 whichare mounted to motherboard 220. As shown, MxM connectors such as 212create elevation between the motherboard 220 and graphics board 230.

The motherboard 220 may include a CPU 225 and socket 228 mounted thereonproviding for processing functionality of the motherboard. The CPU 225and socket system 228 provide a specific height level to the motherboard220. Similarly, graphics board 230 may include a GPU 235 and socketsystem 238 for mounting on the graphics board 230. An offset of “d” 260is shown to occur between the top of the GPU 235 on the graphics board230 and the top of the CPU 225 on the motherboard due to the MxMconnector 212. In the event a shared heat pipe 250 is to be utilized forboth the CPU 225 and GPU 235, a bend 252 or other complexity to the heatpipe must be employed to accommodate the offset “d” 260 between the topof the CPU 225 and the top of the GPU 235. Heat pipe 250 must contactthe top of the CPU 225 and the top of the GPU 235 to draw off heatgenerated during processing and maintain cooler operating temperatureswithout which the processing systems may operate less effectively or mayfail.

FIG. 3A shows a bottom view of a flexible compression jumper connectoraccording to an embodiment of the present disclosure. The flexiblecompression jumper connector shown in FIG. 3A includes a firstcompression jumper pad 302 and a second compression jumper pad 304 foroperative coupling to either a motherboard or a graphics board. Betweenthe first compression jumper pad 302 and the second compression jumperpad 304 is an adjustable jumper trace array cable 306 connecting a firstarray of compressible communication contacts 308 of the firstcompression jumper pad 302 to a second array of compressiblecommunication contacts 310 of the second compression jumper pad 304. Theadjustable jumper trace array cable 306 may be a ribbon cable with aplurality of electrical communication wires or may be a rigid butbendable ribbon of metallic traces or communication connections betweenthe first compression jumper pad 302 and the second compression jumperpad 304. The adjustable jumper trace array cable 306 may have a bendzone for a curve or angle that may be adjusted to alter the height orvertical orientation of the compression jumper pads 302 and 304 withrespect to one another. This angle, curve, or other bend adjustment ofthe compression jumper pads 302 and 304 with respect to one anotherprovides for alignment of an operatively connected motherboard andgraphics board when adjacent to one another. The angle, curve, or otherbend adjustment to the flexible jumper trace array cable 306 mayaccommodate an offset in height of the motherboard and graphics boardthat is less than the offset required of previous connectors such as theMxM connector. The flexible jumper trace array cable 306 adjustabletransition may permit alignment of the CPU with respect to the GPU interms of height within the information handling system housing above thechassis. However, the flexible compression jumper connector provides forgenerally adjacent orientation of the motherboard and graphics board toreduce overall thickness of these components within information handlingsystems.

The compression jumper pad 302 may include an array of compressiblecommunication contacts 308 which, in some embodiments, may include anarray of compressible electrical spring contacts. Each compressibleelectrical spring contact, such as shown at 309, may represent a channelor lane of a communication protocol or may include several lanes orchannels depending on compression or multiplexing of those data streams.Similarly, compression jumper pad 304 may include an array ofcompressible communication contacts 310 which may include an array ofcompressible electrical spring contacts as well. As the compressibleelectrical spring contact is engaged and compressed via a clampingmechanism to a connector pad interface area on the motherboard orgraphics board, the spring contact 309 engages with a correspondingelectrical contact aligned to match up in the connector pad interfacearea of the motherboard or graphics board. In an example embodiment, themotherboard may have an electrical contact in its connector padinterface area that corresponds to one or more of the compressibleelectrical spring contacts 308 of the compression jumper pad 302. Insome example embodiments, each compressible electrical spring contact308 corresponds to an electrical contact in an array of electricalcontacts of the connector pad interface area of the motherboard.Similarly, a graphics board may have one or more electrical contacts inits connector pad interface area that corresponds to one or morecompressible electrical springs 310 of compression jumper pad 304 insome embodiments. In some embodiments, each compressible electricalspring contact of array 310 may have a corresponding electrical contactin the connector pad interface area of the graphics card with which itis matched.

Additional detail of the compression jumper pads 302 and 304 are shownas well. Each compression jumper pad 302 and 304 has a hole, 312 and 314respectively, to accommodate a clamping mechanism in some embodiments.In at least one embodiment, hole 312 may accept a compression screw (notshown) through the compression jumper pad 302. A compression screw maybe used with a compression screw receiver, such as a nut, mounted on orin the motherboard as a clamping mechanism in some embodiments tocompress the compression jumper pad 302 to the motherboard. Acompression screw may compress the compressible electrical springs 308to the electrical contacts in the connector pad interface area of themotherboard.

In a similar embodiment, hole 314 may accept a compression screw throughthe compression jumper pad 304 which may be used with a compressionscrew receiver, such as a nut, mounted on or in the graphics board tocompress the compression jumper pad 304 to the graphics board. Acompression screw (now shown) may compress the compressible electricalsprings 310 to the electrical contacts in the connector pad interfacearea of the graphics board.

In some embodiments, a compressible electrical spring contacts 308 and310 may be made of a variety of metals or metal alloys. In some aspects,electrical conductivity, rigidity, and shape memory are importantqualities as well as enough flexibility to reduce breakage of individualelectrical spring contacts in arrays 308 or 310 during installation oroperation. In one example embodiment, arrays of compressible electricalspring contacts 308 and 310 may be made of beryllium copper alloy whichmay satisfy several of these qualities. Use of beryllium copper for thecompressible electrical spring contacts 308 and 310 may require aplating on the connector pad interface areas of the motherboard orgraphics board to ensure optimal electrical contact between theberyllium copper compressible electrical spring contacts 308 and 310 andthe plurality of electrical contacts in the connector pad interfaceareas. Moreover, surface plating on PCB electrical contacts in connectorpad interface areas may also prevent chemical interaction betweenberyllium copper and the OSP finish on the PCB metal traces used for theelectrical contacts. Masking may be used to provide for a coating, orplating techniques may apply a layer of electrically conductive materialon the contact portions of the connector pad interface areas of themotherboard or graphics board in some embodiments. In an exampleembodiment, a plating using a highly conductive gold alloy or materialincluding conductive gold may be used. For example, in one embodiment,ENIG may be used as a surface plating for the printed circuit boards ofthe motherboard or graphics board. In particular, ENIG may be used assurface plating on the connector pad interface areas of the motherboardor graphics board PCBs with the plurality of electrical contacts servingas PCIe communication wires or DP digital image data communication lanesfrom the CPU to the GPU. Other surface finishes may be used to enhancemetallic compatibility or conductivity between the compressibleelectrical spring contacts 308 and 310 and the electrical contacts ofthe PCBs for the connector pad interface areas of the motherboard andgraphics board. For example, direct gold plating, plating over nickel,HASL, immersion silver (IAg), and other PCB plating materials may beused in some embodiments as well.

In another aspect, compression jumper pads 302 and 304 may havealignment guides 316, such as alignment posts, guide bars, guide groovesor the like that may be used to line up compressible electrical springcontacts 308 and 310 with compression connector pad interface areas onthe motherboard or graphics board in some embodiments. For example,alignment guides 316 may have corresponding alignment holes or alignmentgrooves in the compression connector pad interface area of themotherboard or graphics board to align the compression jumper pads 302and 304 with the compression connector pad interface area. The alignmentposts, for example, may fit into pre-located alignment holes on themotherboard or graphics board. The alignment guides 316 will align thecompressible electrical spring contacts 308 and 310 with a plurality ofcontacts on the compression connector pad interface area of themotherboard or graphics board in some embodiments. In additionalaspects, the alignment guides 316 may align the compression jumper padholes 312 and 314 for receiving a compression screw with a compressionscrew receiver on or in the motherboard or graphics board in someembodiments. This may provide for ease of attachment of the compressionscrew through the hole 312 or 314 in the compression jumper pads 302 and304 to a compression screw receiver. In some embodiments, thecompression screw may even be disposed through the PCB of themotherboard or graphics board to a receiver, such as a nut, below orbehind the motherboard or graphics board.

In another embodiment, not depicted in FIGS. 3A and 3B, some aspects ofembodiments of the present disclosure may utilize a flexible compressionjumper connector, however the array of compressible electrical springcontacts 308 and 310 may be mounted to a compression connector padinterface area for one or either the motherboard or the graphics boardinstead of being disposed on the compression jumper pads. Mounting thecompressible electrical spring contacts 308 and 310 may includesoldering a plate including an array them to the compression connectorpad interface area of the motherboard or graphics board. Thecompressible electrical spring contacts 308 and 310 on the plates may bemounted facing upward or away from the motherboard or graphics board.Then a compression jumper pad similar to either 302 and 304 but with anarray of standard electrical contacts instead of compressible electricalspring contacts may be clamped to the mounted array of compressibleelectrical spring contacts 308 and 310.

The flexible compression jumper connector of this type may also includean adjustable jumper trace array cable between the two compressionjumper pads similar to either 302 and 304 to traverse between thecompression connector pad interface area of the motherboard and graphicsboard respectively. In a flexible compression jumper connector of thistype in some embodiments, a clamping mechanism such as a compressionscrew may be disposed through a hole such as 312 and 314 to clamp thecompression jumper pads, similar to 302 and 304, to the compressibleelectrical spring contacts 308 and 310 mounted on the compressionconnector pad interface areas of the motherboard and the graphics board.The compression screw may be disposed through the compression jumperpads 302 and 304, and the compressible electrical spring contact arrays308 and 310, to a receiver on, in, or through the PCB of the motherboardor the graphics board in various embodiments. The receiver may be acompression screw receiver nut mounted on, in, or behind the PCB.

FIG. 3B shows a top perspective view of a flexible compression jumperconnector according to an embodiment of the present disclosure. Theflexible compression jumper connector shown in FIG. 3B includes a firstcompression jumper pad 302 and a second compression jumper pad 304 foroperative coupling between either a motherboard or a graphics board.Between the first compression jumper pad 302 and the second compressionjumper pad 304 is an adjustable jumper trace array cable 306 connectinga first array of compressible communication contacts of the firstcompression jumper pad 302 to a second array of compressiblecommunication contacts of the second compression jumper pad 304. Theadjustable jumper trace array cable 306 shows a bend to accommodateplanar elevation differences between first compression jumper pad 302and the second compression jumper pad 304 if the PCB of the motherboardand graphics board are not at the same planar elevation in someembodiments. For example, some offset may be necessary to accommodate aplanar heat pipe or for providing orientation flexibility to themotherboard or graphics board relative to other components. As anotherexample, some offset between the motherboard and graphics board may benecessary for alignment of external digital display data ports along aside of the information handling system in some embodiments.

The adjustable jumper trace array cable 306 may be a ribbon cable with aplurality of electrical communication wires or may be a rigid butbendable ribbon of metallic traces or communication connections betweenthe first compression jumper pad 302 and the second compression jumperpad 304. The adjustable transition of the flexible jumper trace arraycable 306 may have a bend zone with a curve or angle that may beadjusted to alter the height or vertical orientation of the compressionjumper pads 302 and 304 with respect to one another. In otherembodiments, the adjustable transition of the flexible jumper tracearray cable 306 may be oriented with no curve or bend between themotherboard and graphics board, but the flexible compression jumperconnector is usable for a plurality of internal transition optionsbetween motherboards and graphics boards for a variety of informationhandling system designs. Adjustment to the adjustable jumper trace arraycable 306 may accommodate an offset in height of the motherboard andgraphics board to permit alignment of the CPU with respect to the GPU interms of height within the information handling system housing above thechassis and may be modified depending on the information handling systemdesign the in which it is implemented. With this adjustability, reducedcosts in implementing motherboard and graphics board designs may berealized since greater flexibility is provided to use motherboard andgraphics board designs repeatedly throughout several differentinformation handling system product specifications. Similarly, lessinvasive motherboard or graphics board design differences will also benecessary when different PCB designs are called for.

Each compression jumper pad 302 and 304 has a hole 312 and 314respectively to accommodate a clamping mechanism in some embodiments. Inat least one embodiment, hole 312 may accept a compression screw throughthe compression jumper pad 302 which may be used with a compressionscrew receiver, such as a nut, mounted on, in, or behind the motherboardto compress the compression jumper pad 302 to the motherboard.Similarly, hole 314 may accept a compression screw through thecompression jumper pad 304 which may be used with a compression screwreceiver, such as a nut, mounted on, in, or behind the motherboard tocompress the compression jumper pad 304 to a graphics board. It isunderstood that in some embodiments, compression jumper pads 302 and 304may be switched as to compression operative coupling between themotherboard or graphics board in some embodiments of the presentdisclosure. Further, compression jumper pads 302 and 304 may havealignment guides 316, such as alignment posts, guide bars, guide groovesor the like that may be used to line up compression jumper pads 302 and304 with compression connector pad interface areas on the motherboard orgraphics board in some embodiments. For example, alignment guides 316may have corresponding alignment holes or alignment grooves in thecompression connector pad interface area of the motherboard or graphicsboard to align the compression jumper pads 302 and 304 with thecompression connector pad interface area. The alignment posts, forexample, may fit into pre-located alignment holes on the motherboard orgraphics board. Other types of alignment mechanisms may also be utilizedin various embodiments.

FIG. 3C shows a cross section view of a flexible compression jumperconnector implemented with a motherboard 320 and a graphic board 330according to an embodiment of the present disclosure. The flexiblecompression jumper connector shown in FIG. 3C includes a firstcompression jumper pad 302 operatively coupled to a connector padinterface area 350 on motherboard 320. In another aspect, secondcompression jumper pad 304 is operatively connected to first compressionjumper pad 302 via an adjustable jumper trace array cable 306. Secondcompression jumper pad 304 is also shown as operatively coupled to aconnector pad interface area 360 on graphics board 330. A cross-sectionof compressible electrical spring connectors may also be seen in firstand second compression jumper pads 302 and 304.

On the motherboard 320, a CPU 325 and CPU chip mount 328 are shownaccording to some embodiments. Likewise, on the graphics board 330, aGPU 335 and GPU chip mount 338 are similarly shown. Difference in heightof the top of CPU 325 and the top of GPU 335 may be accommodated by theadjustable jumper trace array cable 306 bend, curve, or angle to adjustplanar levels of compression jumper pads 302 and 304. In an exampleembodiment, this may be done to provide for a planar heat pipe 352 to beimplemented on both the top of CPU 325 and the top of GPU 335 and acrossmotherboard 320 and graphics board 330. In other embodiments, somemotherboard to graphics board offset may be necessary for alignment withother components in the information handling system such as externaldisplay data ports with the chassis side of the information handlingsystem.

FIG. 3D shows a cross section view of a flexible compression jumperconnector implemented with a motherboard 320 and a graphic board 330according to another embodiment of the present disclosure. In someinstances, the implementation of a graphics board and motherboard isarranged such that minimal lateral or X and Y space is taken by thecombination of the motherboard and graphics board in variousembodiments. For example, the embodiment of FIG. 3D shows the graphicsboard and motherboard stacked such that lateral width and length ofspace taken in a chassis are minimized due to the stacking. This may bethe case, for example, when a cooling fan or other component are alreadyunavoidably thick, but size within the chassis of the informationhandling system is nonetheless to be minimized to reduce the overallsize.

The flexible compression jumper connector shown in FIG. 3D includes afirst compression jumper pad 302 operatively coupled to a connector padinterface area 350 on motherboard 320. In another aspect, secondcompression jumper pad 304 is operatively connected to first compressionjumper pad 302 via an adjustable jumper trace array cable 306. Secondcompression jumper pad 304 is also shown as operatively coupled to aconnector pad interface area 360 on graphics board 330. The adjustablejumper trace array cable 306 may be bent or curved around to allow themotherboard 320 and graphics board 330 to be stacked while maintaininghigh speed display data connectivity between the CPU 325 and GPU 335. Across-section of compressible electrical spring connectors may also beseen in first and second compression jumper pads 302 and 304.

On the motherboard 320, a CPU 325 and CPU chip mount 328 are shownaccording to some embodiments. Likewise, on the graphics board 330, aGPU 335 and GPU chip mount 338 are similarly shown. In the shownembodiment, the motherboard 320 and graphics board 330 may be stackedsuch that the height of the top of CPU 325 and the top of GPU 335 may bestacked by the folded adjustable jumper trace array cable 306 bend,curve, or angle to sandwich a heat pipe 352. The curve, bend, or angleof the folded adjustable jumper trace array cable 306 may adjust planarlevels of compression jumper pads 302 and 304 to size the stacking ofthe CPU 325 and GPU 335 with the heat pipe 352. In an exampleembodiment, this may be done to provide for a planar heat pipe 352 ornear planar heat pipe to be implemented on both the top of CPU 325 andthe top of GPU 335 and between motherboard 320 and graphics board 330.In some embodiments, the GPU 325 and GPU 335 need not be sandwicheddirectly on top of one another on either side of heat pipe 352, but mayinstead be offset to different parts of the heat pipe 352. As with otherembodiments, it is understood that the heat pipe 352 need not beprecisely planar, but fewer bends, angles, or turns may make the heatconductivity of heat pipe 352 more efficient. Thus, the flexiblecompression jumper connector may be used with a stacked motherboard 320and graphics board 330 to minimize the complexity of heat pipe 352 insome embodiments without a requirement of a planar heat pipe.

In other embodiments, some motherboard to graphics board offset of thestacked motherboard and graphics board may be necessary for alignmentwith other components in the information handling system such asexternal display data ports with the chassis side of the informationhandling system or the like instead of alignment around a heat pipe 352.In yet other embodiments, both external component alignment andalignment around a heat pipe 352 may be adjusted for with the flexiblecompression jumper connector of the present embodiments.

FIG. 3E shows a top view of a graphics board PCB 330 according to anembodiment of the present disclosure. Graphics board 330 includes aspace for a GPU 339 and a space for a GPU mount 336. FIG. 3E shows anexample of three connector pad interfaces in a connector pad interfacearea 360 (encircled) on the graphics board 330 along an edge 331.Graphics board 330 would be aligned adjacent to a motherboard (notshown) according some embodiments. Each of the connector pad interfacesin the connector pad interface area 360 on the graphics board 330includes a plurality of electrical contacts 310 according to someembodiments. In some aspects, the plurality of electrical contacts 310of the connector pad interfaces of the connector pad interface area 360may be arranged to correspond to an array of compressible communicationscontacts in the compression jumper pad of the flexible compressionjumper connector similar to that depicted in FIGS. 3A and 3B.

The graphics board 330 of FIG. 3E further shows alignment holes 317 oralignment grooves in the connector pad interface area of the graphicsboard corresponding to alignment guides 316 of FIGS. 3A and 3B that mayalign the compression jumper pads of one or more flexible compressionjumper connectors. The alignment posts, for example, may fit intopre-located alignment holes 317 on the graphics board 330 along edge 331that will be adjacent to the motherboard. Other types of alignmentmechanisms may also be utilized in various embodiments. Further,graphics board 330 shows compression screw receivers 315 in or on thegraphics board 330 according to some embodiments. In a furtherembodiment, the compression screw receivers may be mounted on thegraphics board 330 at locations 315 or embedded in the PCB of graphicsboard 330 at 315. In other embodiments, 315 may be receiving holesthrough which compression screws may be disposed to a compression screwreceiver behind the graphics board 330.

FIG. 4 shows a cutaway perspective view of an example informationhandling system 400 including a motherboard 420 and a graphics board430. Motherboard 420 and graphics board 430 may be arranged ininformation handling system 440 adjacent to one another such as alongedge 431 of graphics board 430. Compression connector pad interface areaof graphics board 430 along edge 431 may be aligned with a compressionconnector pad interface area of the motherboard such that a plurality offlexible compression jumper connectors may be operatively coupledbetween the PCBs to provide for digital data communications between theCPU 425 and GPU 435. The perspective view of the information handlingsystem deploying the embodiments of the present disclosure shows aplanar heat pipe 452 that may be disposed on top of CPU 425 and GPU 435across the motherboard 420 and the graphics board 430.

A plurality of flexible compression jumper connectors are shown spanningbetween connector pad interface areas on the adjacent motherboard 420and graphics board 430. Three flexible compression jumper connectors areshown each including a first compression jumper pad 402 a, 402 b, and402 c operatively coupled to motherboard 420 in an example embodiment.The three flexible compression jumper connectors in the shown embodimenteach have a flexible jumper trace array cable 406 a, 406 b, and 406 coperatively coupled to a second compression jumper pad 404 a, 404 b, and404 c. The second compression jumper pads 404 a, 404 b, and 404 c areoperatively coupled to graphics board 430 in the example embodiment.Additional or fewer flexible compression jumper connectors may be usedfor variable bandwidth as needed in various design embodiments. Forexample, an unused connector pad interface 403 is shown in the connectorpad interface area of motherboard 420.

Motherboard 420 may include a CPU 425 with mounting 428. The CPU 425 andmounting 428 will have a first height for the top of the CPU 425 abovemotherboard 420. Graphics board 430 includes GPU 435 and GPU mountingstructure 435 which may have a second height for the top of the GPU 435above the graphics board 430. Graphics board 430 may also haveadditional components such as on-board memory capacity 433 which mayprovide for improved GPU 435 operation with the separate graphics board430.

If the stack level of GPU 435 and mounting 438 is different from thestack level of CPU 425 and mounting 428, the flexible, adjustable jumpertrace array cables 406 a, 406 b, and 406 c for the flexible compressionjumper connectors may be adjusted to bring the height of the top of CPU425 and GPU 435 to the same level within the chassis of the informationhandling system. In this way, heat pipe 452 may be a planar heat pipeshared by CPU 425 and GPU 435. Graphics board 430 may also externaldisplay connector components 432 for interface outside of the chassis ofthe information handling system in various embodiments which may requireadjustment of the offset of the motherboard 420 and graphics board 430to align with chassis ports in some embodiments. The connectorcomponents 432 may be eDP, DP, USB, or other digital display connectorcomponents and these display connectors may be reconfigurable withrespect to location for various graphics boards 430 designed for use ina variety of information handling systems produced by a manufacturer. Itis understood that motherboard 420 and graphics board 430 offsetadjustments with the presently disclosed embodiments may also beachieved to accommodate various other information handling systemcomponents in yet other embodiments.

FIG. 5A shows a top view of an adaptable graphics board PCB 530adjacently aligned with motherboard 520 according to one embodiment ofthe present disclosure. The adaptable graphics board 530 includes areconfigurable zone subset of components 575 a. The remainder ofgraphics board 530 layout comprises a set of core components that arepart of the adaptable graphic board form factor which may be utilizedwith a plurality of model specifications of information handling systemwith modification needed only of the reconfigurable zone subset ofcomponents 575 a. The set of core components includes a GPU 535 and aspace for a GPU mount 538. The set of core components further includes aplurality of graphics memory chips 507 disposed by the GPU 535. The setof core components also includes, in some embodiments, a connector padinterface area 560 for connection to a motherboard 520 via one or morethe flexible compression jumper connectors according to variousembodiments described herein.

Connector pad interface area 560 shows an example of three connector padinterfaces on the adaptable graphics board 530 along an edge 531 to beshared with an edge having connector pad interface area 550 ofmotherboard 520. In some embodiments, the connector pad interface area560 of adaptable graphics board 530 may be part of a reconfigurable zonesubset of components such that the adaptable graphics board 530 may bereoriented with respect to motherboards in several model specificationdesigns of information handling system products. This embodiment mayprovide for additional flexibility to utilize the set of core componentsfor an adaptable graphics board form factor with a greater group ofmodel specification types for information handling system assemblies insome aspects.

Utilization of an adaptable graphics board form factor with a set ofcore components permits re-utilization of layouts and design efforts fortypically the most difficult or costly aspects of the graphics boarddesign. The set of core components may include aspects such as designselection of location for the GPU 535 and the GPU mount 538. GPU 535 andGPU mount 538 locations will involve the GPU chip pin breakout in thePCB, routing between the GPU 535 and graphics memory, power planes underthe GPU to support the GPU operation, and bus connectivity to theinformation handling system including PCIe, DisplayPort, or otherdisplay data bus connectivity. For example, display data lanes orchannels to the motherboard 520 via the connector pad interface 560 fromthe GPU 535 may be part of the set of core components.

Similarly, the graphics memory placement also comprises difficult designaspects for the adaptable graphics board according to aspects of thepresent disclosure. The graphics memory 507 includes the memoryplacement, pin breakouts, and routing between the GPU and the memory.Further, additional aspects of the set of core components related tographics memory 507 may include the power planes for supplying power tothe memory devices 507. With the adaptable graphics board form factorhaving a set of core components and a design interface point forconnectivity with a reconfigurable zone subset of components, thesimpler reconfigurable zone subset of components may be re-oriented orreorganized, but still connect to the design interface point forconnectivity with the set of core components.

The reconfigurable zone subset of components 575 a may be linked via acommunication and power interface that functions as a design interfacepoint. This design interface point may not be a point per se, but anarea on the PCB or a collection of interface traces or plane locationsthat may be to link the set of core components area of adaptablegraphics board 530 to reconfigurable zone subset of components 575 a orfor different configurations of 575 a as discussed herein. The designinterface point may be located near the reconfigurable zone subset ofcomponents such as 575 a. For example, the design interface point may beembedded communication and power plane traces or layers to which are-oriented reconfigurable zone subset of components, such as 575 a, maybe easily linked when using the adaptable graphics board form factor indesigning the adaptable graphics board 530 for use with several modelspecifications.

This flexibility of having reconfigurable zone subset of componentswhich may be re-organized or re-oriented is beneficial in thedevelopment of a plurality of model specifications for informationhandling system products requiring a separate graphics board forenhanced graphics performance. Several embodiments herein provide for anadaptable graphics board form factor with at least one reconfigurablezone to limit the number of individual specific graphics board designs,each having substantially complete redesign, necessary to fill out allinformation handling system product model specifications offered by amanufacturer. Standardizing at least the difficult parts of theadaptable graphics board with respect to design in an adaptable graphicsboard form factor may decrease costs and time involved with selectinggraphics boards for use with information handling system chassislayouts.

Adaptable graphics board 530 is aligned adjacent to a motherboard 520according some embodiments. Each of the connector pad interfaces in theconnector pad interface area 560 on the graphics board 530 includes aplurality of electrical contacts according to some embodiments hereinand have a counterpart set of connector pad interfaces in connector padinterface area 550 on the motherboard. Motherboard 520 also has a CPU525 and CPU chip mount 528 as well as many other information handlingsystem components as understood in the art which may be mounted onmotherboard 520. Several example embodiment components are discussedwith respect to FIG. 1 and may reside on the motherboard in someexamples.

FIG. 5B shows a top view of an adaptable graphics board PCB 530adjacently aligned with motherboard 520 according to another embodimentof the present disclosure. The adaptable graphics board 530 includes areconfigurable zone subset of components 575 b which is re-oriented withrespect to the remainder of graphics board 530 layout. As previouslydescribed, the remainder of graphics board 530 layout may comprise a setof core components that are part of the adaptable graphic board formfactor to be utilized with a plurality of model specifications ofinformation handling system products. In some embodiments, pluralreconfigurable zones may be used for different subsets of components ofthe adaptable graphics board form factor. For example, a reconfigurationzone may be used for the connector pad interfaces in some embodiments toprovide additional flexibility as to where they are located. Theadaptable graphics board form factor including the set of corecomponents of adaptable graphics board 530 may be used with a pluralityof types of motherboards 520 as shown in FIGS. 5A and 5B in an exampleembodiment.

The modification shown in the adaptable graphics board 530 is to thereconfigurable zone subset of components 575 b of adaptable graphicsboard 530. In the present embodiment of FIG. 5B, the reconfigurable zonesubset of components 575 b is rotated with respect to the orientationshown at 575 a of FIG. 5A. Components 580 and 582 are rotated such thatthey are disposed along a different edge of graphics board 530 in FIG.5B than they were in FIG. 5A. The reconfigurable zone subset ofcomponents 575 b may be linked via a communication and power interface,that may be a design interface point, used in the PCB of the set of corecomponents area of adaptable graphics board 530 and commonly linkable toeither 575 a or 575 b configurations. The communication and powerinterface traces located near the reconfigurable zone subset ofcomponents of either 575 a or 575 b orientation may be embeddedcommunication and power plane traces or layers. These embeddedcommunication and power traces or layers may easily link to are-oriented reconfigurable zone subset of components when using theadaptable graphics board form factor in designing the adaptable graphicsboard 530 for use with several model specifications. The set of corecomponents need not be re-designed while the simpler reconfigurable zonesubset of components in either orientation 575 a or 575 b may becustomized or oriented for use between various model specifications ofinformation handling system products. In an example embodiment, thereconfigurable zone subset of components oriented as either 575 a or 575b may be an I/O module for interface with external display data ports580 or 582.

The set of core components includes a GPU 535 and a space for a GPUmount 538. The set of core components further includes a plurality ofgraphics memory chips 507 disposed by the GPU 535. The set of corecomponents also includes, in some embodiments, a connector pad interfacearea 560 for connection to a motherboard 520 via one or more flexiblecompression jumper connectors according to various embodiments describedherein. The set of core components may include design selection of theGPU 535 and the GPU mount 538 locations. GPU 535 and GPU mount 538locations will involve the GPU chip pin breakout in the PCB, routingbetween the GPU 535 and graphics memory, power planes under the GPU tosupport the GPU operation, and bus connectivity interface link to theinformation handling system including PCIe, DisplayPort, or otherdisplay data bus connectivity. For example, display data lanes orchannels from the connector pad interface 560 on the adaptable graphicsboard to the GPU 535 may be part of the set of core components in someembodiments. In other embodiments, a reconfigurable zone may include theconnector pad interface 560 that may be operatively coupled to GPU 535via a design interface point for the display data lanes or channels.

Similarly, as described above, the graphics memory placement comprisesdifficult design aspects for the adaptable graphics board according toaspects of the present disclosure. The graphics memory 507 includes thememory placement, pin breakouts, and routing between the GPU and thememory. Further, additional aspects of the set of core componentsrelated to graphics memory 507 may include the power planes forsupplying power to the memory devices 507. Thus, as can be seen betweenFIGS. 5A and 5B, the adaptable graphics board form factor with a set ofcore components and a design interface point for connectivity with areconfigurable zone subset of components enables the simplerreconfigurable zone subset of components to be re-oriented orreorganized without a full redesign for the set of core components.

The adaptable graphics board 530 is aligned adjacent to a motherboard520 along edge 531 in both FIGS. 5A and 5B according some embodiments.However a position of external display data ports 580 or 582 or othercomponents may need to be changed to work with chassis configurations ofa plurality of model specifications in various embodiments. Again, theconnector pad interfaces in the connector pad interface area 560 on thegraphics board 530 includes a plurality of electrical contacts accordingto various embodiments herein. The connector pad interfaces operativelycouple to a counterpart set of connector pad interfaces in connector padinterface area 550 on the motherboard 520. Motherboard 520 also has aCPU 525 and CPU chip mount 528 as well as many other informationhandling system components as understood in the art which may be mountedon motherboard 520. Several example embodiment components are discussedwith respect to FIG. 1 and may reside on the motherboard in someexamples.

FIG. 6A shows a closer top view of an adaptable graphics board PCB 630according to one embodiment of the present disclosure. The adaptablegraphics board 630 includes a reconfigurable zone subset of components670 a. The remainder of graphics board 630 layout comprises a set ofcore components 640 that are part of the adaptable graphic board formfactor which may be utilized with a plurality of model specifications ofinformation handling systems. With the adaptable graphics board formfactor, modification is only needed of the reconfigurable zone subset ofcomponents 670 a as described in embodiments above in FIGS. 5A and 5B.The set of core components includes a GPU 635 and a space for a GPUmount 638 as well as a plurality of graphics memory chips 607 and aconnector pad interface area 650 with a plurality of connector padinterfaces shown along edge 630 according to various embodimentsdescribed herein. The set of core components may also include the GPU635 and the GPU mount 638 locations, memory locations, the GPU chip pinbreakout in the PCB, routing between the GPU 635 and graphics memory607, power planes under the GPU 635 and memory 607 to support theiroperation, and bus connectivity interface links to the motherboardincluding PCIe, DisplayPort, or other display data bus connectivity. Theset of core components 640 represent several aspects of the adaptablegraphics board layout and implementation that are more complicated toachieve and implement. Accordingly, flexible re-use of the set of corecomponents 640 with different variations of an adaptable graphics boardusable in a plurality of model specifications for arrangement in thechassis of different information handling system products will improveefficiency and costs of PCB production and assembly.

To enable re-use of the adaptable graphics board form factor for PCBproduction, reconfigurability is needed. A reconfigurable zone subset ofcomponents 670 a, including for example components 680 and 682, must belinked to the set of core components 640. The link may occur a designinterface point 690 to interface the set of core components 640 and thereconfigurable zone subset of components 670 a when in any number oforientations or with a variety of layout organizations. In an exampleembodiment, the design interface point 690 may comprise a communicationor power interface that may be commonly used in the PCB to link the setof core components area 640 to different configurations ofreconfigurable zone subset of components 670 a. In the shown embodiment,three communication and power interface traces in design interface point690 are located near the reconfigurable zone subset of components 670 a.These may include embedded communication traces and at least one powerplane trace or layer as shown. It is understood that any number ofcommunication or power plane traces may be utilized to link tocomponents such as 680 and 682 in reconfigurable zone subset ofcomponents 670 a according to various embodiments.

FIG. 6B shows a closer top view of an adaptable graphics board PCB 630according to another embodiment of the present disclosure. The adaptablegraphics board 630 includes a reconfigurable zone subset of components670 b which is re-oriented with respect to the remainder of graphicsboard 630 layout as compared to 670 a of FIG. 6A. As previouslydescribed, the remainder of graphics board 630 layout comprises a set ofcore components 640 that are part of the adaptable graphic board formfactor which may be utilized with a plurality of model specifications ofinformation handling system products.

The modification shown in the adaptable graphics board 630 is to thereconfigurable zone subset of components 670 b of adaptable graphicsboard 630 which is rotated relative to orientation 670 a from FIG. 6A.Components 680 and 682 are rotated such that they are disposed along adifferent edge of graphics board 630 in FIG. 6B than they were in FIG.6A. The reconfigurable zone subset of components 670 b may be linked viaa communication and power interface, that serves as a design interfacepoint 690, for the adaptable graphics board form factor. The designinterface point may be used in the PCB of the set of core componentsarea of adaptable graphics board 630 and linked to either 670 a or 670 bconfigurations. The communication and power interface traces of thedesign interface point are shown located near the reconfigurable zonesubset of components either 670 a or 670 b. For example, embeddedcommunication and power plane traces or layers may be linkable tore-oriented or reorganized reconfigurable zone subset of components forvarious model specifications of information handling system products.Again, utilization of the embodiments herein permits avoidance ofre-designing the set of core components 640 while the simplerreconfigurable zone subset of components in either orientation 670 a or670 b may be customized or oriented for use between various modelspecifications of information handling system products.

FIG. 6C shows the reconfigurable zone subset of components in the 670 borientation according to an embodiment. The reconfigurable zone subsetof components 670 b may simply be rotatable as shown in someembodiments. In an example embodiment, the reconfigurable zone subset ofcomponents in either 670 a or 670 b orientation may be an I/O module forinterface with external display data ports 680 or 682. In furtherexample embodiments external display ports components 680 or 682 may beHDMI, DisplayPort, USB or other display data external connector socketsof a variety of revisions to those standards as understood by those inthe art. The I/O module of the present embodiment of FIG. 6C shows thatthe orientation may be easily rotated in the design of the adaptablegraphics board in some embodiments with a change in communication andpower linkage locations. In this way, the reconfigurable zone may beintegrated with the set of core components via a design interface pointproviding data communication lines and/or power to link to structures inthe PCB of the reconfigurable zone subset of components 670 b in eitherrotated configuration.

The depictions in FIGS. 3A-3E, FIG. 4 , FIG. 5A, FIG. 5B, and FIGS.6A-6C are meant for illustration and do not necessarily representaccurate sizes or relationships between aspects of the flexiblecompression jumper connectors depicted, the motherboards, graphicsboards, components, or the information handling system depicted therein.It may also be appreciated that variations on the configurations arealso contemplated including location and alignments of motherboard,graphics boards, components thereon. For example, the flexiblecompression jumper connectors may not include compressible communicationcontacts on the compression jumper pads 302 and 304. Those compressiblecommunication contacts may instead be mounted to the compressionconnector pad interface areas of the motherboard or graphics board suchthat the jumper pads are compressed onto the compressible communicationcontacts on the motherboard or graphics board PCB. Other variations ofthe embodiments are contemplated.

FIG. 7 shows a method of selecting an adaptable graphics board andassembling with a motherboard in an information handling systemoperatively coupled with one or more flexible compression jumperconnectors according to an embodiment of the present disclosure. At 705,a selection must be made of a first model specification for aninformation handling system chassis layout from among a plurality ofmodel specifications with which the adaptable graphics form factor maybe implemented according to embodiments herein. Selection of the chassislayout with respect to graphics board and motherboard locations may bespecified for the selected first model specification.

Proceeding to 710, the shared edge across which one or more flexiblecompression jumper connectors may span between corresponding connectorpad interfaces on the adaptable graphics board and the motherboard maybe identified in the first model specification. The adaptable graphicsboard layout will require a selected connector pad interface area alongthe edge of the adaptable graphics board shared with the motherboard.The contact arrays of the connector pad interfaces will be located inthe connector pad interface area of the adaptable graphics board. Theconnector pad interface is for receiving a jumper connector pad for oneor more flexible compression jumper connectors. In some embodiments, theconnector pad interface area location may be part of a set of corecomponents of the adaptable graphics board form factor for board layoutdesign.

In other embodiments, flexibility may be desired for the location of theconnector pad interface area to provide for additional adaptability ofthe graphics board form factor. In those embodiments, a reconfigurablezone subset of components may encompass the connector pad interfacearea. The connector pad interface area may include the connector padinterface electrical contact array or arrays that may be included in atleast one reconfigurable zone in such embodiments. In other aspects ofsuch embodiments, a separate reconfigurable zone may be utilized as wellfor other reconfigurable zone subsets of components such as an I/Omodule as described in embodiments herein.

At 715, the set of core components may be utilized from the adaptablegraphics board form factor and may include the remainder of graphicsboard layout that is not part of one or more reconfigurable zone subsetsof components. The set of core components will involve more complicatedand difficult design elements of the components on a graphic board insome embodiments. The set of core components may be utilized with aplurality of model specifications of information handling system.Modification may then be needed only of the one or more reconfigurablezone subset of components.

The set of core components includes a GPU and a space for a GPU mount aswell as a plurality of graphics memory chips in some embodiments. Theset of core components may also include the GPU and memory locations,the GPU chip pin breakout in the PCB, the memory pin breakout, routingbetween the GPU 635 and graphics memory 607, power planes under the GPUand memory to support their operation, and bus connectivity interfacelink to other parts of the information handling system including PCIe,DisplayPort, or other display data bus connectivity. In an optionalembodiment, the set of core components implemented in the adaptablegraphics board form factor may also include one or more connector padinterface areas with a plurality of connector pad interfaces along anedge to be shared with the motherboard. Since the set of core componentsrepresent several aspects of the adaptable graphics board layout withimplementation that is more complicated, flexibility to re-use thisportion of the adaptable graphics board form factor for a plurality ofmodel specification chassis arrangements will improve efficiency andcosts of PCB production and assembly.

Selection of the first model specification will also indicate a locationfor reconfigurable zone subset of components on the adaptable graphicsboard at 720 in some embodiments. For example, in the case that at leastone reconfigurable zone subset of components includes an I/O module forconnectivity of the adaptable graphics board to display data externalport locations, location of those external display data ports in thechassis may be identified. Further, the location of the external displaydata ports for the first model specification, such as DisplayPort, HDMI,USB, or other display data communication port components, will beidentified on the adaptable graphics board. The external display dataports or connector hardware components will be located to align with theexternal locations along an edge or back of the information handlingsystem chassis for the selected first model specification in an exampleembodiment.

The adaptable graphics board form factor will also be provided forflexibility to utilize the reconfigurable zone subset of components suchas the I/O module described above to easily interface with theestablished set of core components. The set of core components for theadaptable graphics board form factor will include a design interfacepoint to interface with the reconfigurable zone subset of components at725. The design interface point may include one or more communicationand power interface traces to couple with the reconfigurable zone subsetof components. In embodiments, the design interface point may be on theset of core components, but located near the reconfigurable zone tooperably couple to the subset of components therein.

For example, a common I/O module connection location in the set of corecomponents may be used as a design interface point with thereconfigurable I/O module in a plurality of orientations orconfigurations. The design point interface may include a plurality ofcommunication and power traces or planes to be operatively connected toexternal display data ports, such as sockets for external displayconnections, among components in the reconfigurable zone subset ofcomponents. Further, at 730, the overall rotation of the flexible,reconfigurable I/O module may utilize placement of the external displayport socket locations on an edge of the adaptable graphics board todetermine the orientation of the reconfigurable I/O module with respectto the remaining set of core components. The rotation of thereconfigurable zone, such as a reconfigurable I/O module, may providefor communication and power coupling from the design point interface tothe components on the reconfigurable zone subset components.

Upon determination of the reconfigurable zone orientation, such asrotation or organization and location of components and theirconnections the PCB design of the adaptable graphics board to be usedwith the selected first model specification may be determined at 735. Inan example embodiment, the adaptable graphics board design may bedetermined using the above aspects to provide for the flexible I/Omodule placement and location of external display data port sockethardware on the adaptable graphics board.

At 745, the motherboard and adaptable graphics board may be operablycoupled with one or more flexible compression jumper connectorsaccording to various embodiments herein. Compression screws or anotherclamping mechanism may be utilized to compress compressible electricalcontact arrays of each flexible compression jumper connector to aconnector pad interface area of the adaptable graphics board or themotherboard. For example, compression screws may be disposed throughholes in the compression jumper pads to receivers on the respectiveadaptable graphics board or motherboard.

The motherboard and the adaptable graphics board may be arranged withrespect to one another in the chassis of the selected first modelspecification. Adjacent orientation of the adaptable graphics board tothe motherboard may be used to reduce the height or z-space occupied byboth PCB boards with the information handling system. This may assist inreducing the thickness of the information handling system. Stackingorientation may be used to reduce the planar length or width areaoccupied by the PCB boards in the chassis in other embodiments.

As described with other embodiments, adjustment of levels of the tops atleast one CPU and the top at least one GPU may be better aligned withrespect to a heat pipe by adjusting the flexible compression jumperconnector or connectors between the motherboard and the graphics boardthus reducing complexity of heat pipe implementation. In other aspects,alignment of the motherboard and graphics board may be adjusted with theflexible transition provided by the compression jumper connector orconnectors to accommodate alignment with other information handlingsystem components, such as external display data ports, within thechassis of the first model specification. At this point the process mayend. It is appreciated that the process described with respect to FIG. 7may be utilized for any selected model specification from among aplurality of model specifications of information handling systemproducts. In this way, the adaptable graphics board form factor may beutilized with reduced modification needed and applied to a wide varietyof chassis layouts including a variety of motherboard designs forseveral product models. Such a feature is beneficial to costs and timeof development of graphics boards for use with model specificationassemblies of a wider variety of information handling system models andimproving overall design efficiencies.

FIG. 8A shows a top view of a PCB for an adaptable graphics board 830according to one embodiment of the present disclosure. The adaptablegraphics board 830 includes a PCB for a reconfigurable I/O module board870 a mounted in the upper right corner in an embodiment. The remainderof graphics board 830 comprises a set of core components 840 that arepart of the adaptable graphic board form factor which may be utilizedwith a plurality of model specifications of information handlingsystems. With the adaptable graphics board 830, the reconfigurable I/Omodule board 870 a need only be rotated into position such that externaldisplay data ports 880 and 882 are aligned along a desired edge to beimplemented with a model specification for an information handlingsystem. The set of core components 840 includes a GPU 835, a GPU mount838, a plurality of graphics memory chips 807, and a connector padinterface area 850. As with various embodiments herein, the connectorpad interface area 850 may include one or more connector pad interfacesshown along edge 831 according to various embodiments described herein.In some embodiments, edge 831 may be aligned along a shared edge with amotherboard (not shown) having one or more connector pad interfacesalong a corresponding PCB edge. In such embodiments, a flexiblecompression jumper connector may be used to span between the motherboardand operatively coupled to the connector pad interface area 850. Theflexible compression jumper connector may provide for lanes or channelsfor display data and commands between the CPU and the GPU 835.Utilization of the flexible compression jumper connector (not shown) tooperatively couple the motherboard and adaptable graphics board 830provides for flexibility to use several optional adjacent or stackedorientations between the motherboard and adaptable graphics board 830.This permits better adaptability among a plurality of modelspecifications for multiple information handling system product types asdescribed in several embodiments herein. Further, the variety ofadaptable orientations permitted with the adaptable graphics board 830and use of flexible compression jumper connectors provides for benefitsof reduced thickness in some embodiments or reduced x,y space occupancyin other embodiments for a variety of model specifications.

The set of core components of the adaptable graphics board 830 mayfurther include the GPU 835 location, the GPU mount 838 location, memorylocations, the GPU chip pin breakout in the PCB, routing between the GPU835 and graphics memory 807, power planes under the GPU 835 and memory807 to support their operation, and bus connectivity interface links tothe motherboard including PCIe, DisplayPort, or other display data busprotocols. The set of core components 840 represent several aspects ofthe adaptable graphics board layout and implementation that are morecomplicated to achieve and implement. Accordingly, the set of corecomponents 840 may be re-used with only variation of the orientation ofthe reconfigurable I/O module board 870 a and a dual compressionconnector (not shown) to operatively couple the reconfigurable I/Omodule board 870 a with the base portion of the adaptable graphics board830. In this way, different variations of the adaptable graphics board830 may be created that are usable in a plurality of modelspecifications for arrangement in the chassis of different informationhandling system products. With only re-orientation of reconfigurable I/Omodule board 870 a necessary in some embodiments, this will improveefficiency and costs of PCB production and assembly.

The reconfigurable I/O module board 870 a includes a compression screwhole 814 or other structure to provide for clamping the reconfigurableI/O module board 870 a to the main portion of the adaptable graphicsboard 830. A compression screw may be disposed through 814, or anotherclamping system may be used, to compress compressible electricalcontacts to make an electrical and mechanical operative coupling. Thecompression screw may be threaded into a compression screw receivermounted on, in, or under the adaptable graphics board 830. Thecompression screw or other clamping mechanism compresses one or morecompressible electrical contacts to establish a mechanical andelectrical operative coupling between the reconfigurable I/O moduleboard 870 a and the adaptable graphics board 830 in various embodiments.The compressible electrical connectors may be disposed on a dualcompression connector inserted between the reconfigurable I/O moduleboard 870 a and the main portion of the adaptable graphics board 830 asdescribed herein. Reconfigurable I/O module board 870 a may have anarray of electrical contacts to interface with the compressibleelectrical contacts of the dual compression connector on one side in anembodiment. Similarly, a reconfigurable I/O module interface may includean array of electrical contacts as well at which the compressibleelectrical contacts of a second side of the dual compression connectorare compressed. In other embodiments, the compressible electricalconnectors may be mounted on the reconfigurable I/O module interface ofthe main portion of the adaptable graphics board or on thereconfigurable I/O module board 870 a instead.

The reconfigurable I/O module board 870 a will be re-orientable suchthat location or placement of one or more components may be adjusted tofit various model specifications. This may include, for example,reorienting components 880 and 882, which are operatively connected tothe set of core components 840 in a plurality of configurations asdescribed further in embodiments herein. In the shown embodiment of FIG.8A, the reconfigurable I/O module board 870 a is oriented such thatexternal I/O ports 880 and 882 are oriented along a first edge of theadaptable graphics board 830. External I/O display data ports 880 and882 may be HDMI, DisplayPort, USB, or other ports capable ofaccommodating other protocols. In the shown embodiment, thereconfigurable I/O module board 870 a is shown with I/O components 880and 882 arranged along the top edge of the adaptable graphics board 830opposite the connector pad interface area 850 along edge 831. It isunderstood that the adaptable graphics board may be implemented in anyorientation with a motherboard in the chassis of an information handlingsystem including in adjacent or stacked implementations in various modelspecification requirements. Example embodiments depicted in FIGS. 3A-5Bmay be utilized with the reconfigurable I/O module board 870 a of theadaptable graphics board 830 shown in FIG. 8A-8D.

FIG. 8B shows a top view of a PCB for an adaptable graphics board 830according to another embodiment of the present disclosure. The adaptablegraphics board 830 includes a PCB for a reconfigurable I/O module board870 b mounted in the upper right corner in another embodiment. As withFIG. 8A, remainder of graphics board 830 in FIG. 8B comprises a set ofcore components 840 that are part of the main portion of the adaptablegraphic board 830 which may be utilized with a plurality of modelspecifications of information handling systems. The adaptable graphicsboard 830 includes the reconfigurable I/O module board 870 b which isre-oriented with respect to the remainder of adaptable graphics board830 layout as compared to 870 a of FIG. 8A.

In the shown embodiment of FIG. 8B, the reconfigurable I/O module board870 b is oriented such that external display data ports 880 and 882 areoriented along a second edge of the adaptable graphics board 830. In theshown embodiment, the reconfigurable I/O module board 870 b is shownwith I/O components 880 and 882 arranged along the right edge of theadaptable graphics board 830 next to edge 831 with the connector padinterface area 850. It is understood that the adaptable graphics boardmay be implemented in any orientation with a motherboard in the chassisof an information handling system. Arrangement adaptable graphics board830 with a motherboard may include various adjacent configurations whererelative height of a CPU or GPU may be adjusted in some embodiments. Inother embodiments, arrangement may be stacked implementations of themotherboard and the adaptable graphics board 830 around a heat pipe invarious model specification requirements.

The modification shown in the adaptable graphics board 830 FIG. 8B is tothe reconfigurable I/O module board 870 b of adaptable graphics board830 which is rotated relative to orientation 870 a from FIG. 8A. In theexample embodiment, reconfigurable I/O module board 870 b is rotated 90°such that components 880 and 882 are disposed along a different edge ofgraphics board 830 in FIG. 8B. Adaptable graphics board 830 may then beutilized with port mountings in an information handling system chassisof a different model specification than that shown in FIG. 8A. Again,utilization of the embodiments herein permits avoidance of re-designingthe set of core components 840 on the base portion of the adaptablegraphics 830 while the reconfigurable I/O module board in eitherorientation 870 a or 870 b may be simply oriented at different 90°positions to customize it for use between various information handlingsystem products. Utilization of a dual compression connector asdescribed in embodiments below may enable reorientation with electricaldata communication connections between the base portion of the adaptablegraphics board 830 and the reconfigurable I/O module board 870 b ineither orientation in some embodiments. The shown example indicates a90° rotation clockwise of the reconfigurable I/O module board between870 a and 870 b between FIGS. 8A and 8B. It is contemplated thatrotation may occur clockwise or counter-clockwise and may be made at anyangle of rotation for alignment of components 880 and 882 as needed invarious embodiments.

The reconfigurable I/O module board 870 b shows a compression screw hole814 or may incorporate other structures to provide for clamping thereconfigurable I/O module board 870 b to the main portion of theadaptable graphics board 830. As described, a compression screw may bedisposed through 814, or another clamping system, may be used tocompress compressible electrical contacts to make an electrical andmechanical operative coupling between the reconfigurable I/O moduleboard 870 b and the main portion of the adaptable graphics board 830.The compression screw may be threaded into a compression screw receivermounted on, in, or under the adaptable graphics board. This is discussedfurther in embodiments herein.

FIG. 8C shows a top view of a reconfigurable I/O module board 870 b foruse with the adaptable graphics board of embodiments herein. Thereconfigurable I/O module board 870 b may simply be rotatable as shownin some embodiments. In an example embodiment, the reconfigurable I/Omodule board in either 870 a or 870 b orientation may include mountedexternal display data ports 880 or 882. As described, the exampleembodiments of external display ports components 880 or 882 may be HDMI,DisplayPort, USB or other display data external connector sockets of avariety of data protocol standards or revisions of the same asunderstood by those in the art. The reconfigurable I/O module board 870b of the present embodiment of FIG. 8C shows that the orientation may beeasily rotated relative to a set of core components on a portion of theadaptable graphics board to which reconfigurable I/O module board 870 bis operatively coupled in various embodiments.

Operative coupling of the reconfigurable I/O module board 870 b mayoccur via compression connection of electrical communication lanes orchannels via compression contacts such as compressible electrical springcontacts. Compressible electrical spring contacts may be mounted on thereconfigurable I/O module board 870 b, on the main portion of theadaptable graphics board, or may be disposed on a dual compressionconnector between the reconfigurable I/O module board 870 b and theadaptable graphics board as described in various embodiments. Thereconfigurable I/O module board 870 b also includes a compression screwhole 814 or other structure to work with a clamping mechanism to providefor clamping the reconfigurable I/O module board 870 b to the mainportion of the adaptable graphics board shown in FIGS. 8A and 8B. Acompression screw may be disposed through 814 to compress one or morecompressible electrical contacts to establish a mechanical andelectrical coupling between the reconfigurable I/O module board 870 band the main portion of the adaptable graphics board in variousembodiments. In other embodiments, another clamping mechanism may beused instead of or in addition to a compression screw threaded into acompression screw receiver. Configuration and orientation of a dualcompression connector disposed between the reconfigurable I/O moduleboard and the main portion of the adaptable graphics board may beimplemented in some embodiments to provide in communication and powerlinkage for either orientation 870 a or 870 b. In this way, thereconfigurable I/O module board 870 b may be integrated with the set ofcore components via a reconfigurable I/O module interface on the mainportion of the adaptable graphics board. The reconfigurable I/O moduleinterface on the main portion of the adaptable graphics board mayprovide data communication lines and/or power to links to componentssuch as 880 and 882 in the PCB of the reconfigurable I/O module board870 b in either rotated configuration.

FIG. 8D shows a top view of a PCB for an adaptable graphics board 830according to another embodiment of the present disclosure. The adaptablegraphics board 830 does not include a reconfigurable I/O module boardmounted in the upper right corner in an embodiment and instead shows areconfigurable I/O module interface 862 to which a reconfigurable I/Omodule board may be operatively coupled. As with FIGS. 8A and 8B, theremainder of the adaptable graphics board 830 in FIG. 8D comprises a setof core components 840 that are part of the adaptable graphic boardwhich may be utilized with a plurality of model specifications ofinformation handling systems. The adaptable graphics board 830 set ofcore components 840 includes graphics memory 807, a GPU 835, a GPU mount838, a flexible jumper connector interface area 860 along an edge 831and other aspects as described for FIGS. 8A and 8B. Again, it isunderstood that the adaptable graphics board 830 may be implemented inany orientation with a motherboard in the chassis of an informationhandling system including in an adjacent or stacked orientation invarious model specification requirements.

The reconfigurable I/O module interface 862 shows a compression screwreceiver 813 which may be threads in the PCB of the main portion of theadaptable graphics board 830 or may be a compression screw nut mountedon, in, or under the adaptable graphics board main portion 830. Stillother embodiments may incorporate other structures to provide forclamping of a reconfigurable I/O module board to the reconfigurable I/Omodule interface 862 of the main portion of the adaptable graphics board830.

As described, a compression screw may be disposed into compression screwreceiver 813 or another clamping system may be used to compresscompressible electrical contacts on a dual compression connector to makean electrical and mechanical operative coupling between thereconfigurable I/O module board and the reconfigurable I/O moduleinterface 862. The dual compression connector may be disposed betweenthe reconfigurable I/O module interface 862 and the reconfigurable I/Omodule board to be operatively coupled for communication of display dataor power. In one embodiment, one side of the dual compression connectormay have an array of compressible electrical contacts which maycorrespond to the array of contacts 864 on the reconfigurable I/O moduleinterface 862.

The dual compression connector may include alignment guides, such asalignment posts, which may fit into the alignment guide receivers 817 inthe PCB of the adaptable graphics board 830. The alignment guidereceivers 817 will ease placement of the dual compression connector onthe reconfigurable I/O module interface 862. For example, alignmentguide receivers 817 may be holes in the PCB to receive alignment guideposts on a first side of a dual compression connector. In otherembodiments, the adaptable graphics board may have alignment guides suchas posts that fit into receivers of a dual compression connectorinstead. A similar alignment guide and alignment guide receivercombination may be utilized to align the reconfigurable I/O module boardand the dual compression connector on a second side as described andshown in FIG. 9 . For example, either the second side of the dualcompression connector or the reconfigurable I/O module board may havealignment posts with the other having holes to receive the alignmentposts in an example embodiment. The compression screw may be disposedthrough a hole in the reconfigurable I/O module board and a hole in thedual compression connector to a compression screw receiver 813 mountedon, in, or under the adaptable graphics board 830.

Compression via tightening of this compression screw may establish amechanical and electrical contact between the compressible electricalcontacts on the first side of the dual compression connector and thearray of contacts 864 of reconfigurable I/O module interface 862 in anembodiment. Compression may also establish a mechanical and electricalcontact between compressible electrical contacts on the second side ofthe dual compression connector and an array of contacts on thereconfigurable I/O module board in some embodiments. In otherembodiments, an array of compressible electrical contacts may be used at864 on the reconfigurable I/O module interface 862 of the adaptablegraphics board to contact an array of contacts on the first side of thedual compression connector in some aspects. In yet other embodiments, anarray of compressible electrical contacts may be used on thereconfigurable I/O module board to contact an array of contacts on thesecond side of the dual compression connector in other aspects. Furtherembodiments herein may utilize different clamping mechanisms.

The reconfigurable I/O module interface 862 and array of contacts 864may provide to interface the set of core components 840 and thecomponents of the reconfigurable I/O module board in any number oforientations for a variety of model specifications. In an exampleembodiment, the reconfigurable I/O module interface 862 may comprise acommunication or power interface to link the set of core components 840to different orientations of the reconfigurable I/O module board. Thedual compression connector may be re-oriented as disposed between thereconfigurable I/O module interface 862 of the adaptable graphics board830 and the reconfigurable I/O module board to provide both datacommunications and power connections to I/O display data ports in anyrotated position. In the shown embodiment, the array of contacts 864 ofthe reconfigurable I/O module interface 862 must include a plurality ofcommunication and power interface contacts which link to embeddedcommunication traces and at least one power plane trace or layer of themain portion of the adaptable graphics board 830 according to variousembodiments.

FIG. 9 shows a cross section view of a dual compression connector 975according to an embodiment of the disclosure. Dual compression connector975 may be disposed between a reconfigurable I/O module interface on anadaptable graphics board and reconfigurable I/O module board havingexternal I/O display data ports or other I/O module components. The dualcompression connector 975 may include a first side which may include afirst array of compressible electrical contacts 961 in some embodimentsas described above. The dual compression connector 975 may also includea second side with a second array of compressible electrical contacts971 in other embodiments. The first array of compressible electricalcontacts 961 may be used to make an operative electrical coupling to thereconfigurable I/O module interface on the adaptable graphics board insome embodiments. The second array of compressible electrical contacts971 may be used to make an operative electrical coupling to thereconfigurable I/O module board in some embodiments. In otherembodiments, 961 may represent an array of electrical contacts on thefirst side of the dual compression connector 975 that may interface withan array of compressible electrical contacts mounted on the adaptablegraphics board at reconfigurable I/O module interface. In yet furtherembodiments, 971 may represent an array of electrical contacts on thesecond side of the dual compression connector 975 that may interfacewith an array of compressible electrical contacts mounted on thereconfigurable I/O module board.

Between the first array of electrical contacts 961 and the second arrayof electrical contacts 971 of the dual compression connector, is a PCBlayer 977. PCB layer 977 provides for routing and connection betweenindividual contacts in the first array of electrical contacts 961 andindividual contacts in the second array of electrical contacts 971. Byrotation of the dual compression connector 975 to a first orientation, afirst subset of the first array of electrical contacts 961 may beoperatively coupled to the array of contacts of the reconfigurable I/Omodule interface of the adaptable graphics board. With this firstsubset, connection may be made through a subset of the second array ofelectrical contacts 971 on the second side to connect to the externaldisplay data ports of the reconfigurable I/O module in the firstorientation.

Similarly, upon rotation of the dual compression connector 975 to asecond orientation a second, different subset of the first array ofelectrical contacts 961 may operatively couple to the reconfigurable I/Omodule interface contacts. In the second orientation, some of thesecond, different subset of 961 may be re-used in some aspects. In otheraspects, an entirely different subset of contacts may be used. With thissecond subset of the array of electrical contacts 961, connection may bemade through to a different subset of the second array of electricalcontacts 971 on the second side to connect the external display dataports of the reconfigurable I/O module in the second orientation.Additional orientations options may be available in some embodiments.With the plurality of orientations, different subsets of contacts forthe first array of contacts 961 may be operatively coupled and providecoupling through to corresponding subsets of the second array ofcontacts 971 on the second side of the dual compression connector 975.Thus, connectivity to display data communication lines and power planesof the adaptable graphics board may be altered to the I/O components ofa reconfigurable I/O module board in either the first or secondorientations via the dual compression connector 975 in variousembodiments.

The dual compression connector 975 may also include alignment guides 916in an embodiment to assist in ease of placement and orientation betweenan adaptable graphics board and reconfigurable I/O module board.Alignment guides 916 may be used on either the first side to align thefirst array of contacts 961, on the second side to align the secondarray of contacts 971, or on both sides. In some embodiments, alignmentguides 916 are alignment posts that may fit into holes or alignmentguide receivers in the adaptable graphics board and the reconfigurableI/O module board to align both with the dual compression connector 975.In other embodiments, either or both of the first or second sides of thedual compression connector 975 may have alignment guide receivers to fitwith alignment guides, such as posts, from either the adaptable graphicsboard or the reconfigurable I/O module board. Various other alignmentstructures may be utilized as understood in the art.

FIG. 10A shows a block diagram of an adaptable graphics board 1030 witha reconfigurable I/O module board 1070 a mounted in a first orientationaccording to an embodiment of the present disclosure on a left corner ofthe adaptable graphics board 1030 such that the reconfigurable I/Omodule board 1070 a has a left I/O orientation according to oneembodiment of the disclosure. In the shown embodiment, the external I/Oports 1080 and the external I/O port 1082 are aligned on a left sideedge of the adaptable graphics board 1030. A dual compression connector1075 a is shown in the first orientation providing operative couplingfor data connectivity and power from the main portion of the adaptablegraphics board 1030. In a first aspect, display data lines and power1090, for example in the form of PCB traces and power planes, areoperatively coupled to a first subset plurality of electrical contactsat a reconfigurable I/O module interface on the adaptable graphicsboard. The display data lines and power 1090 connect from the set ofcore components such as the GPU to provide for data and power lanes toan external I/O connector 1080. Those display data lines and power 1090are in contact with a first side of the dual compression connector 1075a in the first orientation and a first subset of contacts in the arrayof contacts on the first side of 1075 a. The contacts on the first sideof dual compression connector 1075 a are linked to a second subset ofcontacts which are further linked on to the second side as depicted viaa PCB layer disposed between the first and second side of 1075 a. Theadditional second side contacts of the dual compression connector areoperatively coupled to data and power lines 1091 in the reconfigurableI/O module board PCB 1070 a. The data and power line traces 1091 in thereconfigurable I/O module board 1070 a are coupled through the PCB of1070 a to the external I/O port 1080. In the shown example embodiment,an HDMI external I/O connector is shown at 1080.

A second set display data lines and power 1092, for example in the formof PCB traces and power planes in the adaptable graphics board, areoperatively coupled to a second subset plurality of electrical contactsat a reconfigurable I/O module interface on the adaptable graphicsboard. The display data lines and power 1092 connect from the set ofcore components, such as the GPU, to provide for data and power lanes toa second external I/O connector 1082. Those display data lines and power1092 are in contact with a first side of the dual compression connector1075 a at a third subset of contacts in the array of contacts on thefirst side via the reconfigurable I/O module interface. The third subsetof contacts on the first side of dual compression connector 1075 a arelinked to contacts on the second side via a pass-through of the PCBlayer of 1075 a as depicted. The additional second side contacts of thedual compression connector are operatively coupled to data and powerlines 1093 in the reconfigurable I/O module board PCB 1070 a. The dataand power line traces 1093 in the reconfigurable I/O module board 1070 aare coupled through the PCB to the external I/O port 1082. In the shownexample embodiment, an mDP external I/O connector is shown at 1082.

FIG. 10B shows a block diagram of an adaptable graphics board 1030 witha reconfigurable I/O module board 1070 b mounted in a second orientationaccording to an embodiment of the present disclosure at a left corner ofthe adaptable graphics board 1030 in a left I/O orientation. In theshown embodiment, the external I/O ports for HDMI 1080 and the externalI/O port for mDP 1082 are aligned on a top edge of the adaptablegraphics board 1030. The reconfigurable I/O module board 1070 b has beenrotated 90° relative to 1070 a as shown in FIG. 10A. A dual compressionconnector 1075 b is shown in the second orientation providing operativecoupling for data connectivity and power from the main portion of theadaptable graphics board 1030. In this second orientation, dualcompression connector 1075 b is rotated 180° relative to 1075 a in FIG.10A. This is done to provide for connectivity among contacts for dataand power to supply the external I/O display data ports 1080 and 1082.

In a first aspect, display data lines and power 1090, for example in theform of PCB traces and power planes in the adaptable graphics board1030, are operatively coupled to a first subset plurality of electricalcontacts at a reconfigurable I/O module interface on the adaptablegraphics board. The display data lines and power 1090 connect from theset of core components such as the GPU and provide data and power lanesto an external I/O connector 1080. Those display data lines and power1090 are in contact with a first side of the dual compression connector1075 b in the second orientation. The display data lines and power 1090are operatively coupled to a fourth subset of contacts in the array ofcontacts on the first side 1075 b. The fourth subset of contacts on thefirst side of dual compression connector 1075 b are linked as passthrough to contacts on the second side of the dual compression connector1075 b as depicted. The pass through to the second side contacts of thedual compression connector via the fourth subset of contacts areoperatively coupled to data and power lines 1091 in the reconfigurableI/O module board PCB 1070 b in the second orientation. The data andpower line traces 1091 in the reconfigurable I/O module board 1070 borientation are still coupled through the PCB to the external I/O port1080. In the shown example embodiment, an HDMI external I/O connector isshown at 1080.

A second set display data lines and power 1092, for example in the formof PCB traces and power planes in the adaptable graphics board, areoperatively coupled to the second subset plurality of electricalcontacts at a reconfigurable I/O module interface on the adaptablegraphics board. The display data lines and power 1092 connect from theset of core components such as the GPU to provide for data and powerlanes to a second external I/O connector 1082. Those display data linesand power 1092 are in contact with a first side of the dual compressionconnector 1075 b at a first subset of contacts in the array of contactson the first side of the dual compression connector 1075 b. The secondsubset of contacts on the first side of dual compression connector 1075b are linked to the first subset of contacts as depicted in anembodiment. The first subset of contacts are linked to the second sideas depicted through a PCB layer between the first and second side in anexample embodiment. Other connections through the central PCB layer of1075 b may be implements as understood as well. The additional secondside contacts of the dual compression connector are operatively coupledto data and power lines 1093 in the reconfigurable I/O module board PCB1070 b in the second orientation. The data and power line traces 1093 inthe reconfigurable I/O module board 1070 a are coupled through the PCBto the external I/O port 1082. In the shown example embodiment, an mDPexternal I/O connector is shown at 1082.

Pursuant the above example embodiment, the same reconfigurable I/Omodule board may be used in two orientations 1070 a and 1070 b alongwith the same design for a dual compression connector in twoorientations 1075 a and 1075 b to achieve mechanical and electricaloperative coupling between the reconfigurable I/O module board and anadaptable graphic board 1030. With the above example embodiment,external I/O display data ports may be rotated between two edges of theadaptable graphics board by merely changing orientation of thereconfigurable I/O module board from 1070 a to 1070 b or vice-versa. Toachieve electrical operative coupling, the dual compression connectorneed only be rotated between 1075 a and 1075 b before applying aclamping mechanism to compress the dual compression connectors. It isappreciated that other sides and rotations may be utilized with the sameor similar reconfigurable I/O module boards and dual compressionconnectors. In some example embodiments, the connectivity through thedual compression connector may only require a 90° rotation or mayrequire rotation in a different direction. In yet other embodiments,flipping the first and second sides of the dual compression connectormay achieve electrical operative coupling when reconfigurable I/O moduleboard needs to be rotated from 1070 a to 1070 b or vice-versa. It may beappreciated that subsets of arrays of connectors on the first or secondsides of the dual compression connector may be connected in a variety offormats through the PCB layer between the first and second sides toachieve reconfigurability with rotation of reconfigurable I/O moduleboards from 1070 a to 1070 b or vice-versa.

The above descriptions are only meant as an exemplary embodiment of thereconfigurable I/O module board being re-oriented in combination withre-orientation options for a dual compression connector to achievereconfigurable electrical data and power coupling without requiringredesign of the adaptable graphics board main portion 1030 in variousembodiments. Further, a reconfigurable I/O module board may not need tobe redesigned in some embodiments and may merely be rotated to desiredpositions of external I/O components 1080 and 1082 in other embodimentsas described in examples above and variations to the same. Additionally,a dual compression connector may be designed to be reorientable incoordination with the reconfigurable I/O module board change in rotationto provide for electrical data and power coupling with the main portionof the adaptable graphics board 1030 in yet other embodiments. It isappreciated that connectivity between the first and second sides of adual compression connector may be made through the middle PCB layer of1075 a or 1075 b in any variety of configurations in embodimentscontemplated herein.

In yet other embodiments, rotation of reconfigurable I/O module boardfrom 1070 a to 1070 b or vice-versa may not be necessary and use ofdifferent reconfigurable I/O module boards in arrangements similar to1070 a and 1070 b may be used depending on the orientation desired. Asanother embodiment, different dual compression connector designs may beused between a first or second orientation in some embodiments requiringonly rotation of the reconfigurable I/O module board from 1070 a to 1070b or vice-versa and use of the appropriate dual compression connectorfor either rotation option. Even in these embodiments, a great deal ofsavings may be achieved by reuse of the set of core component layoutdesign of the main portion of the adaptable graphics board 1030.Further, it is understood that arrays of contacts may be compressibleelectrical contacts deployed on a variety of surfaces in the aboveembodiments including on the first and second sides of the dualcompression connector, on the reconfigurable I/O module board, or on themain portion of the adaptable graphics board 1030.

FIG. 11 shows a method of selecting an adaptable graphics board andassembling with a motherboard in an information handling systemoperatively coupled with one or more flexible compression jumperconnectors according to an embodiment of the present disclosure. At1105, a selection must be made of a first model specification for aninformation handling system chassis layout from among a plurality ofmodel specifications with which the adaptable graphics form factor maybe implemented according to embodiments herein. Selection of the chassislayout with respect to graphics board and motherboard locations may bespecified for the selected first model specification.

Proceeding to 1110, the shared edge across which one or more flexiblecompression jumper connectors may span between corresponding connectorpad interfaces on the main portion of the adaptable graphics board andthe motherboard may be identified in the first model specification. Theadaptable graphics board will require a selected connector pad interfacearea along the edge of the adaptable graphics board shared with themotherboard. The contact arrays of the connector pad interfaces will belocated in the connector pad interface area of the adaptable graphicsboard. The connector pad interface is for receiving a jumper connectorpad for one or more flexible compression jumper connectors.

At 1115, the set of core components may be utilized from the mainportion of the adaptable graphics board which is a form factor and mayinclude the remainder of graphics board layout with a set of corecomponents. The set of core components will involve more complicated anddifficult design elements of the components on a graphic board in someembodiments. The set of core components may be utilized with a pluralityof model specifications of information handling system. Modification ofthe adaptable graphics board may then be needed only of a reconfigurableI/O module board operatively coupled to the main portion of theadaptable graphics board in one of a plurality of orientations.

The set of core components includes a GPU and a space for a GPU mount aswell as a plurality of graphics memory chips in some embodiments. Theset of core components may also include the GPU and memory locations,the GPU chip pin breakout in the PCB, the memory pin breakout, routingbetween the GPU and graphics memory, power planes under the GPU andmemory to support their operation, and bus connectivity interface linkto other parts of the information handling system including PCIe,DisplayPort, or other display data bus connectivity. The set of corecomponents implemented in the main portion of the adaptable graphicsboard may also include one or more connector pad interface areas with aplurality of connector pad interfaces along an edge to be shared withthe motherboard. Since the set of core components represent severalaspects of the adaptable graphics board layout with implementation thatis more complicated, flexibility to re-use this portion of the mainportion of the adaptable graphics board for a plurality of modelspecification chassis arrangements will improve efficiency and costs ofPCB production and assembly.

Selection of the first model specification will also indicate a locationfor external display data port components on the reconfigurable I/Omodule board and along a choice of edges of the adaptable graphics boardat 1120 in some embodiments. For example, the location of the externaldisplay data ports for a first model specification, such as DisplayPort,HDMI, USB, or other display data communication port components, may beidentified on the adaptable graphics board. The external display dataports or connector hardware components will be located to align with theexternal locations along an edge or back of the information handlingsystem chassis for the selected first model specification in an exampleembodiment.

The adaptable graphics board will also be provided for flexibility toutilize the reconfigurable I/O module board to easily interface with theestablished set of core components via a dual compression connector at areconfigurable I/O module board interface area. The set of corecomponents for the adaptable graphics board will include reconfigurableI/O module board interface area to interface with the reconfigurable I/Omodule board. The reconfigurable I/O module board interface may includean array of contacts including one or more communication and powerinterface contacts to couple with the reconfigurable I/O module boardand its components.

At 1125, the overall rotation of the reconfigurable I/O module board mayutilize placement of the external display port socket locations on anedge of the adaptable graphics board to determine the orientation of thereconfigurable I/O module board with respect to the main portion of theadaptable graphics board. The rotation of the reconfigurable I/O moduleboard may provide for communication and power coupling from the mainportion of the adaptable graphics board to the external I/O display dataport components and their intended location along a side of the chassisof the information handling system. In an example embodiment, theadaptable graphics board design may be flexible in selection among aplurality of orientations for the reconfigurable I/O module board forplacement and location of external display data port socket hardware onthe adaptable graphics board.

At 1130, the dual compression connector may be used to operativelycouple the reconfigurable I/O module board and the interface area on themain portion of the adaptable graphics board. The dual compressionconnector may have a first side and a second side with arrays ofcontacts on each side which are operatively coupled to provideelectrical communication coupling between the first and second sides.The arrays of contacts may be compressible electrical spring contacts invarious embodiments to permit compression electrical contact with thereconfigurable I/O module board or the adaptable graphics board in someembodiments herein. In other embodiments, the compressible electricalspring contacts may be mounted on the reconfigurable I/O module board orthe adaptable graphics board.

Selection of the rotation of the dual compression connector may be madeto provide for corresponding coupling between data and power lanes inthe main portion PCB of the adaptable graphics board and external I/Odisplay data ports on the reconfigurable I/O module board in accordancewith various embodiments herein. Alignment guides may be used on thedual compression connector to align with alignment guide receivers onthe main portion of the adaptable graphics board around thereconfigurable I/O module board interface in embodiments. In otherembodiments, the alignment guides may be mounted on the adaptablegraphics board for alignment on alignment guide receivers on the dualcompression connector. As described in embodiments herein, the dualcompression connector may be rotatable such that it may accommodate aplurality of orientations of the reconfigurable I/O module board to setthe external display data ports along a plurality of edges. In otherembodiments, a different dual compression connector may be selected toaccommodate the rotation of the reconfigurable I/O module board and itsexternal display data ports at 1130. In yet other embodiments, differentreconfigurable I/O module board design with contacts connecting todifferent placement of the external display data ports may be selectedat 1130 to achieve a different orientation and location of externaldisplay data ports along a different edge of the adaptable graphicsboard.

Proceeding to 1135, alignment guides may be used on the dual compressionconnector to align with alignment guide receivers on the reconfigurableI/O module board in embodiments. In this way the reconfigurable I/Omodule board may be aligned on the dual compression connector. In otherembodiments, the alignment guides may be mounted on the reconfigurableI/O module board for alignment on alignment guide receivers on the dualcompression connector. As described in embodiments herein, thereconfigurable I/O module board will be rotated and aligned tooperatively couple with the dual compression connector rotated orselected to provide electrical coupling for data between the mainportion of the adaptable graphics board and the set the external displaydata ports along a plurality of edges.

At 1140, compression screws or another clamping mechanism may beutilized to compress compressible electrical contact arrays of the dualcompression connector disposed between the reconfigurable I/O moduleboard and the reconfigurable I/O module board interface area of the mainportion of the adaptable graphics board. For example, compression screwsmay be disposed through holes in the reconfigurable I/O module board andthe dual compression connector to receivers on, in, or behind the mainportion adaptable graphics board. For example, a compression screw maybe threaded into a compression screw receiver in the adaptable graphicboard or a compression nut mounted thereon.

At 1145, the motherboard and adaptable graphics board may be operablycoupled with one or more flexible compression jumper connectorsaccording to various embodiments herein. Compression screws or anotherclamping mechanism may be utilized to compress compressible electricalcontact arrays of each flexible compression jumper connector to aconnector pad interface area of the adaptable graphics board or themotherboard. For example, compression screws may be disposed throughholes in the compression jumper pads to receivers on the respectiveadaptable graphics board or motherboard.

The motherboard and the adaptable graphics board may be arranged withrespect to one another in the chassis of the selected first modelspecification. Adjacent orientation of the adaptable graphics board tothe motherboard may be used to reduce the height or z-space occupied byboth PCB boards with the information handling system. This may assist inreducing the thickness of the information handling system. Stackingorientation may be used to reduce the planar length or width areaoccupied by the PCB boards in the chassis in other embodiments.

As described with other embodiments, adjustment of levels of the tops atleast one CPU and the top at least one GPU may be better aligned withrespect to a heat pipe by adjusting the flexible compression jumperconnector or connectors between the motherboard and the graphics boardthus reducing complexity of heat pipe implementation. In other aspects,alignment of the motherboard and graphics board may be adjusted with theflexible transition provided by the compression jumper connector orconnectors to accommodate alignment with other information handlingsystem components, such as external display data ports, within thechassis of the first model specification. At this point the process mayend. It is appreciated that the process described with respect to FIG.11 may be utilized for any selected model specification from among aplurality of model specifications of information handling systemproducts. In this way, the adaptable graphics board form factor may beutilized with reduced modification needed and applied to a wide varietyof chassis layouts including a variety of motherboard designs forseveral product models. Such a feature is beneficial to costs and timeof development of graphics boards for use with model specificationassemblies of a wider variety of information handling system models andimproving overall design efficiencies.

The depictions in FIGS. 3A-3E, FIG. 4 , FIG. 5A, FIG. 5B, FIGS. 6A-6C,and FIGS. 8A-8D are meant for illustration and do not necessarilyrepresent accurate sizes or relationships between aspects of theflexible compression jumper connectors depicted, the motherboards,graphics boards, components, or the information handling system depictedtherein. It may also be appreciated that variations on theconfigurations are also contemplated including location and alignmentsof motherboard, graphics boards, components thereon. For example,location of compressible communication contacts may be on thecompression pads of the flexible compression jumper connectors or themotherboard or adaptable graphics boards. Similarly, the location ofcompressible communication contacts may be on the adaptable graphicsboard or the reconfigurable I/O module board instead of one or bothsides of the dual compression connector. Other variations of theembodiments are contemplated.

It is understood that the structures and concepts described in theembodiments above for FIGS. 1-6C and 8A-10B may be constructed using avariety of the components. For example, the compressible spring contactstructures may be any of or a combination of deflectable wires, springs,strips, or other structures understood in the art to apply a counterforce when compressed to make mechanical and electrical contact with acorresponding electrical contact compressed into the compressible springcontact. It is also understood that for the methods in FIGS. 7 and 11some steps may be omitted, additional steps may be performed, or stepsmay not be performed in the order depicted according to variations ofthe embodiments as understood by those of skill. In particular, forembodiments of the figures disclosed herein, some varied embodiments mayutilize certain components or techniques which may also be combined withportions of any other embodiments in the present disclosure to form avariety of additional embodiments from aspects of those embodimentsdescribed herein.

In some embodiments, dedicated hardware implementations such asapplication specific integrated circuits, programmable logic arrays andother hardware devices can be constructed to implement one or more ofthe internal components described herein or portions of one or more ofthe internal components described herein. Applications that may includethe apparatus and systems of various embodiments can broadly include avariety of electronic and computer systems. One or more embodimentsdescribed herein may implement functions using two or more specificinterconnected hardware structures to provide a simplified access tointernal components of a mobile information handling system whilemaintaining a unibody appearance between the display screen and thechassis.

In accordance with various embodiments of the present disclosure, thecompressive force structures described are understood by those of skillin the art to be a structure when placed between to objects and subjectto compressive stress responds with a counterforce against thatcompressive stress. Example specific structures such as compressivepads, foam, springs, bladders, or shape memory devices that return to anoriginal shape after stress of compression is release and describedherein may be implemented by numerous embodiments described.

When referred to as a “device,” a “module,” or the like, the embodimentsdescribed herein can be configured as hardware. For example, a portionof an information handling system device may be hardware such as, forexample, an integrated circuit (such as an Application SpecificIntegrated Circuit (ASIC), a Field Programmable Gate Array (FPGA), astructured ASIC, or a device embedded on a larger chip), a card (such asa Peripheral Component Interface (PCI) card, a PCI-express card, aPersonal Computer Memory Card International Association (PCMCIA) card,or other such expansion card), or a system (such as a motherboard, asystem-on-a-chip (SoC), or a stand-alone device). The device or modulecan include software, including firmware embedded at a device, such asan Intel® Core™ or ARM® RISC brand processors, or other such device, orsoftware capable of operating a relevant environment of the informationhandling system. The device or module can also include a combination ofthe foregoing examples of hardware or software. Note that an informationhandling system can include an integrated circuit or a board-levelproduct having portions thereof that can also be any combination ofhardware and software.

Devices, modules, resources, or programs that are in communication withone another need not be in continuous communication with each other,unless expressly specified otherwise. In addition, devices, modules,resources, or programs that are in communication with one another cancommunicate directly or indirectly through one or more intermediaries.Further, devices, structures or other aspects of the mobile informationhandling systems described or shown as coupled or connected to oneanother or applying force to one another may be connected or coupled inall cases through one or more additional intermediary structures ordevices or some structures and devices may not be needed or intermediaryas shown or described. Several example embodiments are described wheresuch a coupling or connection of structures may exist.

Although only a few exemplary embodiments have been described in detailherein, those skilled in the art will appreciate that many modificationsare possible in the exemplary embodiments without materially departingfrom the novel teachings and advantages of the embodiments of thepresent disclosure. Accordingly, all such modifications are intended tobe included within the scope of the embodiments of the presentdisclosure as defined in the following claims. In the claims,means-plus-function clauses are intended to cover the structuresdescribed herein as performing the recited function and not onlystructural equivalents, but also equivalent structures.

What is claimed is:
 1. An adaptable graphics board form factor designcomprising: an adaptable graphics board for an information handlingsystem including a set of core components comprising a graphicsprocessor and a graphics memory, the adaptable graphics board tointerface with a motherboard of the information handling system along afirst edge of the adaptable graphics board; and a reconfigurable zonesubset of components having a modifiable location for external displaydata ports disposed along a second edge of the adaptable graphics boardwith respect to the set of core components, wherein the adaptablegraphics board is implementable with a plurality of model specificationsfor information handling systems depending on orientation of theexternal display data ports.
 2. The adaptable graphics board form factorof claim 1 wherein the external display data ports interface with a sideof a chassis of a first model specification of the information handlingsystem.
 3. The adaptable graphics board form factor of claim 2 whereinthe external display data ports may be relocated on the reconfigurablezone subset of components to a third edge of the adaptable graphicsboard to interface with a side of a chassis of a second modelspecification that is a different side than the side of the chassis ofthe first model specification of information handling system.
 4. Theadaptable graphics board form factor of claim 1 wherein thereconfigurable zone subset of components may be rotated such that theexternal display data ports may interface with a side of a chassis of asecond model specification that is a different side than the side of thechasses of the first model specification of information handling system.5. The adaptable graphics board form factor of claim 1 wherein the setof core components includes an array of electrical contacts at aconnector pad interface area along the first edge for receiving an arrayof compressible electrical spring contacts of a compression jumper padfor a flexible compression jumper connector to interface with themotherboard.
 6. The adaptable graphics board form factor of claim 1wherein the set of core components further comprises a graphicsprocessor pin break out, and data routing between the graphics processorand graphics memory.
 7. The adaptable graphics board form factor ofclaim 1, further comprising: a reconfigurable I/O module providing anI/O connection point between the graphics processor and in thereconfigurable zone subset of components to provide operative couplingto the external display data ports in a plurality of orientationswithout reconfiguration of the set of core components.
 8. An informationhandling system comprising: a chassis supporting a motherboard and anadaptable graphics board, wherein the motherboard and graphics board areadjacently aligned; the adaptable graphics board includes a set of corecomponents for interfacing with the motherboard, wherein the set of corecomponents includes a graphics processor and graphics memory; theadaptable graphics board further includes a reconfigurable zone subsetof components that is configured to interface with the informationhandling system chassis of a first model specification and is modifiableto a plurality of orientations usable with a plurality of modelspecifications; and the reconfigurable zone subset of componentsincludes a modifiable location for external display data ports such thatorientation of the reconfigurable zone subset of components may beadjusted with respect to the set of core components and the informationhandling system chassis.
 9. The system of claim 8, wherein thereconfigurable zone subset of components includes at least one externaldisplay data port customized for interface with the information handlingsystem chassis.
 10. The system of claim 8, wherein the reconfigurablezone subset of components may be rotated with respect to the set of corecomponents such that the adaptable graphics board may interface withmultiple configurations of locations of motherboard and informationhandling system chassis for a plurality of model specifications ofinformation handling systems.
 11. The system of claim 8, furthercomprising: the adaptable graphics board set of core componentsincluding a first connector pad interface area; and a flexiblecompression jumper connector having a first compression jumper pad witha first array of compressible communication contacts operatively coupledto the first connector pad area of the adaptable graphics board.
 12. Thesystem of claim 11, wherein the flexible compression jumper connectorincludes a second compression jumper pad operatively coupled to a secondconnector pad interface area of the motherboard.
 13. The system of claim12, wherein the flexible compression jumper connector has a flexiblejumper trace array cable between the first compression jumper pad andthe second compression jumper pad adjustable as to relative heightbetween the graphics board and the adjacent motherboard and providinglanes of data communication between a central processor on themotherboard and the graphics processor.
 14. The system of claim 11,further comprising: A first clamping mechanism including a compressionscrew to compress the first array of compressible communication contactsto a plurality of electrical contacts at the first connector padinterface area, wherein the compression screw is threaded into acompression screw receiver mounted on or in the adaptable graphicsboard.
 15. The system of claim 8 wherein the set of core components ofthe adaptable graphics board further comprises power planes supplyingthe graphics processor and graphics memory.
 16. A method of assemblingan information handling system with an adaptable graphics board formfactor in comprising: selecting a first model specification selectedfrom a plurality of model specifications for information handlingsystems in which an adaptable graphics board may be used; orientating areconfigurable zone subset of components relative to a set of corecomponents of the adaptable graphics board, wherein the orientation isadapted to the first model specification, and wherein the set of corecomponents includes a graphics processor and a graphics memory; aligninga first edge of the adaptable graphics board adjacent to a motherboardand a second edge of the adaptable graphics board with a side of aninformation handling system chassis; interfacing the adaptable graphicsboard at the first edge with the motherboard via a flexible compressionjumper connector; and operatively coupling at least one external displaydata port along the second edge to interface with the side of theinformation handling system chassis.
 17. The method of claim 16, furthercomprising: selecting a second model specification selected from theplurality of model specifications for information handling systems inwhich the adaptable graphics board may be used; and orienting thereconfigurable zone subset of components relative to a set of corecomponents, wherein the second orientation is adapted to interface witha chassis of the second model specification along a different edge ofthe adaptable graphics board than the orientation for the first modelspecification.
 18. The method of claim 16, wherein the reconfigurablezone subset of components includes an I/O module for I/O connectivitybetween the at least one external display data port in a plurality oforientations and the set of core components.
 19. The method of claim 16,wherein interfacing the adaptable graphics board at the first edge withthe motherboard via the flexible compression jumper connector includesoperatively coupling a first compression jumper pad with a first arrayof compressible communication contacts at the first edge of theadaptable graphics board.
 20. The method of claim 16, whereininterfacing the adaptable graphics board at the first edge with themotherboard via the flexible compression jumper connector furtherincludes operatively coupling a second compression jumper pad coupled tothe first compression jumper pad with a second array of compressiblecommunication contacts at the motherboard.